Packaging Engineer
Jobs under Packaging Engineer
-
Advanced Packaging Process Engineer - Arizona, Phoenix, United States
Intel Corporation
On-site
US, Arizona, Phoenix, United States
October 3, 2026
-
Sr. Packaging Engineer (Semiconductor) - IND - Hyderabad, India
Semtech
On-site
IND - Hyderabad, India
October 1, 2026
-
Silicon Packaging Design Engineer - Bangalore, India
Intel Corporation
On-site
India, Bangalore, India
October 1, 2026
-
CDI - Flip-Chip Process Development Engineer - Advanced Packaging & Photonics F/H - Grenoble, France
STMicroelectronics
On-site
Grenoble, France
August 13, 2026
-
Advanced Packaging Process Integration Engineer
Intel Corporation
On-site
2 Locations
October 2, 2026
-
Robotics Deployment Engineer, Robotics Delivery Packaging and Innovation - Berlin, DEU, Germany
Amazon
Full-time
On-site
Berlin, DEU, Germany
September 29, 2026
-
Package Layout Design Engineer , Annapurna Labs - AI Silicon Packaging - Haifa, ISR, Israel
Amazon
Full-time
On-site
Haifa, ISR, Israel
September 27, 2026
-
Sr. Staff Packaging Engineer- Process Package Integrity & Bumping - San Diego, California, United States of America
Qualcomm
On-site
San Diego, California, United States of America
September 25, 2026
-
Advanced Packaging Module Development Engineer - Oregon, Hillsboro, United States
Intel Corporation
On-site
US, Oregon, Hillsboro, United States
September 25, 2026
-
Senior Advanced Packaging Defect Inspection Engineer - Oregon, Hillsboro, United States
Intel Corporation
On-site
US, Oregon, Hillsboro, United States
September 25, 2026
-
Semiconductor Advanced Packaging Process Engineering Intern - US-CA-Santa Rosa-Bldg 2, United States
Keysight Technologies
Internship
On-site
US-CA-Santa Rosa-Bldg 2, United States
September 24, 2026
-
External Manufacturing NPI Engineer (Assembly Packaging) - Petaling, Selangor, Malaysia
onsemi
On-site
Petaling, Selangor, Malaysia
September 25, 2026
-
Packaging Engineering Intern MS/PhD - United States
Texas Instruments
Internship
On-site
United States
September 24, 2026
-
Senior Manager, Semiconductor IC Packaging & Assembly Engineering - Batu Berendam, my, Malaysia
Renesas Electronics
Full-time
On-site
Batu Berendam, my, Malaysia
September 24, 2026
-
Senior Manager, Semiconductor IC Packaging & Assembly Engineering - Shah Alam, my, Malaysia
Renesas Electronics
Full-time
On-site
Shah Alam, my, Malaysia
September 24, 2026
-
Quantum Packaging Signal/Power Integrity (SI/PI) Engineer - Oregon, Hillsboro, United States
Intel Corporation
On-site
US, Oregon, Hillsboro, United States
$141,910 - $200,340 USD yearly
September 24, 2026
-
Senior Engineer, Semi Packaging Engineering - Vendor, Taiwan
Analog Devices
On-site
Taiwan, Vendor, Taiwan
September 24, 2026
-
Senior Packaging Engineer - Batu Kawan, my, Malaysia
SanDisk
Full-time
On-site
Batu Kawan, my, Malaysia
September 3, 2026
-
MTS/Principal Process Module Engineer - Advanced Packaging Program (2.5D and 3D Heterogeneous Integration) - Singapore
GlobalFoundries
On-site
Singapore
September 2, 2026
-
Senior Staff Packaging Engineering - Batu Kawan, my, Malaysia
SanDisk
Full-time
On-site
Batu Kawan, my, Malaysia
September 1, 2026
-
Shift Process Engineer, Advanced Packaging Technology Development (APTD) - Boise, ID - Main Site
Micron Technology
Full-time
On-site
Boise, ID - Main Site
September 1, 2026
-
IC Packaging Engineer - Taipei, Taiwan
Apple
On-site
Taipei, Taiwan
September 23, 2026
-
Packaging Engineering Intern - Dallas, TX, United States
Texas Instruments
Internship
On-site
Dallas, TX, United States
September 23, 2026
-
Semiconductor Packaging Modeling and Simulation Engineer - Waterloo, ON, Canada
onsemi
On-site
Waterloo, ON, Canada
€76,900 - €127,000 EUR yearly
September 23, 2026
-
Quality and Reliability Engineer (Advance Packaging & Assembly) - Penang, Malaysia
Intel Corporation
Remote friendly (Malaysia, Penang, Malaysia)
Malaysia
September 23, 2026
-
Manufacturing- Logistics Rigging & Packaging Engineer- Linkou
ASML
Full-time
On-site
Linkou, Taiwan
September 23, 2026
-
Intern, NPI Packaging Engineer - Fall 2026 - San Diego, CA, United States
pSemi
Internship
On-site
San Diego, CA, United States
September 22, 2026
-
Lead Engineer, Packaging Project
Allegro MicroSystems
On-site
Paranaque City, National Capital Region (Manila), Philippines
September 4, 2026
-
Sr. Signal & Power Integrity Engineer, Annapurna Labs - AI Silicon Packaging - Austin, Texas, United States
Amazon
Full-time
On-site
Austin, Texas, United States
September 22, 2026
-
Semiconductor Packaging Modeling and Simulation Engineer - Waterloo, ON, Canada
onsemi
On-site
Waterloo, ON, Canada
September 22, 2026
-
DMTS Process Development Engineer, Advanced Packaging - Boise, ID - Main Site
Micron Technology
Full-time
On-site
Boise, ID - Main Site
September 21, 2026
-
Packaging Engineer - Suzhou, China
AMD
Full-time
On-site
CN, Suzhou, China
September 7, 2026
-
Packaging Engineer - Suzhou, China
AMD
Full-time
On-site
CN, Suzhou, China
September 7, 2026
-
Advanced IC Packaging - Staff Engineer - Irvine, CA, United States
Skyworks
On-site
Irvine, CA, United States
September 21, 2026
-
Signal & Power Integrity Engineer, Annapurna Labs - AI Silicon Packaging - Austin, Texas, United States
Amazon
Full-time
On-site
Austin, Texas, United States
September 21, 2026
-
IC Packaging Design Engineer, Amazon Leo - San Diego, California, United States
Amazon
Full-time
On-site
San Diego, California, United States
September 21, 2026
-
Staff Packaging Engineer - Irvine, CA, United States
Skyworks
On-site
Irvine, CA, United States
September 21, 2026
-
Staff Packaging Engineer - Irvine, CA, United States
Skyworks
On-site
Irvine, CA, United States
September 21, 2026
-
Principal Packaging Engineer - Irvine, CA, United States
Skyworks
On-site
Irvine, CA, United States
$129,400 - $247,800 USD yearly
September 21, 2026
-
Staff Packaging Design Engineer封装开发工程师 （功率模块） - Shanghai, China
Renesas Electronics
Full-time
On-site
Shanghai, China
September 9, 2026
-
Staff Packaging Design Engineer封装开发工程师 （功率模块） - Suzhou, China
Renesas Electronics
Full-time
On-site
Suzhou, China
September 9, 2026
-
Career Accelerator Program - Packaging Engineer - Dallas, TX, United States
Texas Instruments
On-site
Dallas, TX, United States
September 20, 2026
-
Technology Development Process Engineer (Hybrid Bonding & Advanced Packaging) - SGP, Singapore
Applied Materials
On-site
Singapore, SGP, Singapore
September 17, 2026
-
Senior Director, Silicon Hardware Engineering - Boards, Packaging, & Reliability - San Jose, California, United States
Altera
Full-time
On-site
San Jose, California, United States
$231,500 - $335,000 USD yearly
September 11, 2026
-
Packaging Engineer (Substrate Design and Layout, Only open for fresh graduate) - Taichung, Taiwan
SanDisk
Full-time
On-site
Taichung, Taiwan
September 11, 2026
-
Silicon Packaging Engineer - Intern & New Grad - Mountain View, CA, United States
Lightmatter
Internship
On-site
Mountain View, CA, United States
September 11, 2026
-
Foundry 3D Packaging Engineer - TX, Austin, United States
AMD
Full-time
On-site
US, TX, Austin, United States
September 18, 2026
-
Staff/Principal, APTD CEM - Advanced Packaging Wafer Level Technology Engineering - Fab 10A, Singapore
Micron Technology
Full-time
On-site
Fab 10A, Singapore
September 15, 2026
-
Staff/Principal Engineer, APTD CEM - Advanced Packaging Die Level Technology Engineering - Fab 10A, Singapore
Micron Technology
Full-time
On-site
Fab 10A, Singapore
September 15, 2026
-
Senior Engineer II, Process Engineering (Advanced Packaging) - Singapore
ASM International
On-site
Singapore
September 15, 2026
Showing 1 to 50