Packaging Engineer Intern - Milpitas, CA, United States
Originally posted 5 October 2026 by the employer.
About the role
MACOM is seeking a Packaging Engineer Intern to support the design, development, and implementation of packaging solutions for RF semiconductor devices.
What you'll do
- Assist in package design work and create or review assembly drawings using CAD software. - Collect experimental data directly or coordinate testing with external labs using metrology and failure analysis tools. - Design experiments and analyze results using statistical techniques and process improvement methodology. - Run thermal and mechanical simulations with FEA software packages to characterize new materials and device designs. - Prepare documentation and periodically present reports of engineering work to team members and management.
What you'll need
- Active enrollment in an engineering degree program related to semiconductor packaging, mechanical engineering, materials science, or a related discipline. - Familiarity with CAD software for drafting and reviewing assembly drawings. - Exposure to metrology and failure analysis tools and techniques. - Knowledge of statistical techniques and experimental design methodologies. - Foundational understanding of thermal and mechanical simulation using FEA software packages.
Skills: package design, CAD, assembly drawings, FEA, metrology
This role has been open 0 days — well below the 57-day median for Packaging Engineering roles.
Packaging Engineering · Packaging
|
Open roles in category
220
|
Median days open
57 d
|
Median salary
$165k
|
See the full market breakdown ▾Category comparison, skills in demand, and who else is hiring
| Metric | MACOM | All employers we track in this specialty (220 roles · 42 employers) |
|---|---|---|
| Open roles in this specialty | 8 | 220 |
| Open roles in the wider Process, Fab & Equipment family | 90 | 10278 · 109 employers |
| Median days open | 0 d | 57 d (−57 d vs this employer) |
| Median salary (USD postings) | — | $165k |
Skills observed across this category: package design, CAD, assembly drawings, FEA, metrology
Who's hiring in this category
- Renesas Electronics · 31 open roles · median 37 d
- Infineon Technologies · 25 open roles · median 36 d
- Micron Technology · 20 open roles · median 77 d
- onsemi · 16 open roles · median 33 d
- Skyworks · 12 open roles · median 10 d
- Intel Corporation · 11 open roles · median 112 d
How we counted: 220 open Packaging Engineering (Packaging) roles from 42 employers tracked in the SemiconductorJobs index, counted 28 Oct 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.