• Senior Packaging Module Development Engineer
$133,800 - $255,200 USD yearly
Originally posted 12 November 2026 by the employer.
About the role
As a Senior Packaging Module Development Engineer within the Substrate Packaging Technology Development (SPTD) organization, you will develop, optimize, and implement processes, materials, and equipment configurations for IC substrate and packaging technologies.
What you'll do
- Develop and refine packaging processes and materials to meet quality, reliability, yield, and cost targets.
- Define and establish equipment configurations, process parameters, and integrated workflows for advanced IC substrate and packaging technologies.
- Design and execute experimental plans using Design of Experiments (DOE) principles to characterize process windows and analyze material and equipment interactions.
- Apply statistical methods, data analytics, and engineering scripting tools to optimize manufacturing processes and resolve IC substrate development challenges.
- Implement continuous process improvements to enhance tool stability, product quality, and manufacturing productivity.
- Author technical documentation, including white papers and process specifications, to support technology transfer.
What you'll need
- Bachelor's degree in Materials Science, Mechanical Engineering, Chemical Engineering, Polymer Engineering, or a related field with 6+ years of related experience; OR Master's degree with 4+ years of related experience; OR PhD with 2+ years of related experience.
- Experience with Design of Experiments (DOE), statistical data analysis, and process control tools.
- Understanding of IC substrate and/or advanced packaging processing principles.
- Experience using engineering programming tools such as JMP, Python, MATLAB, or similar software for process modeling or data analysis.
Nice to have
- 3+ years of experience in dielectric materials formulation (structure/property relations expertise) or processing.
- 3+ years of experience with Finite Element Analysis (FEA) modeling tools such as COMSOL or Ansys.
- 3+ years of experience in machine learning or artificial intelligence applications for engineering scenarios.
- 3+ years of experience designing experimental setups to validate modeling and simulation outputs.
More semiconductor jobs: Intel Corporation jobs · Packaging engineer jobs · Arizona jobs
First seen in our index 0 days ago, well below the 61-day median for Packaging Engineering roles.
Packaging Engineering · Advanced Packaging
|
Open roles in category
328
|
Median days since first seen
61 d
|
Category median salary (all employers)
$167k
|
See the full market breakdown ▾Category comparison, and who else is hiring
| Metric | Intel Corporation | All employers we track in this specialty (328 roles · 64 employers) |
|---|---|---|
| Open roles in this specialty | 24 | 328 |
| Open roles in the wider Process, Fab & Equipment family | 239 | 10362 · 117 employers |
| Median days since first seen | 34 d | 61 d (+27 d vs this employer) |
| Median salary (USD postings) | n/a | $167k |
Who's hiring in this category
- Micron Technology · 44 open roles · median 58 d
- KLA Corporation · 39 open roles · median 152 d
- Intel Corporation (this employer) · 23 open roles · median 34 d
- Renesas Electronics · 23 open roles · median 36 d
- Lumilens · 13 open roles · median 97 d
- AMD · 12 open roles · median 42 d
How we counted: 328 open Packaging Engineering (Advanced Packaging) roles from 64 employers tracked in the SemiconductorJobs index, counted 12 Nov 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there, and is counted in the wider Process, Fab & Equipment family row. Days are counted from when our index first saw each posting, not from the employer's original posting date.