Co-Packaged Optics Packaging Process Development Engineer
$141,150 - $211,400 USD yearly
Originally posted 6 November 2026 by the employer.
About the role
This role utilizes process engineering and partner management experience to bring AI products from concept to high-volume manufacturing. You will manage and drive assembly process technology development in close collaboration with foundries and OSATs for design for manufacturing, reliability, and cost.
What you'll do
- Lead process development at foundries and 2.5D/3D CoW assembly development with packaging consumable suppliers at OSATs from concept to high-volume manufacturing.
- Manage qualification of packages with sensitivity to physics of failures for thermo-mechanical reliability within established cost constraints.
- Manage internal and external resources to meet corporate milestones and ensure factory readiness during the NPI phase.
- Drive advanced package solutions and specifications with vendors to support product integration and productization efforts.
What you'll need
- 7+ years of experience in semiconductor packaging, process, and technology development.
- Understanding of advanced foundry process nodes and their interaction with packaging, assembly, and substrates across multiple package technologies.
- Hands-on expertise in advanced packaging technologies, including high-density interconnects with TSVs in 2.5D/3D package form factors and 2.5D/3D CoW assembly development.
- Experience delivering products through technology development, package design/definition, qualification, NPI, and HVM.
- Working knowledge of package architecture, design rules, BOM, enabling material/process technologies, mechanical design, DFM, component and system-level reliability, testing, and FA.
- M.S. or Ph.D. in Chemical Engineering, Materials Science, Mechanical Engineering, Chemistry, or Physics.
Nice to have
- Experience with photonics packaging.
Skills: 2.5D/3D, CoW, TSV, wafer process development, OSAT
More semiconductor jobs: Marvell Technology jobs · Packaging engineer jobs · Santa Clara jobs
This role has been open 0 days — well below the 58-day median for Packaging Engineering roles.
Packaging Engineering · Advanced Packaging
|
Open roles in category
313
|
Median days open
58 d
|
Category median salary (all employers)
$167k
|
See the full market breakdown ▾Category comparison, skills in demand, and who else is hiring
| Metric | Marvell Technology | All employers we track in this specialty (313 roles · 64 employers) |
|---|---|---|
| Open roles in this specialty | 1 | 313 |
| Open roles in the wider Process, Fab & Equipment family | 11 | 10123 · 117 employers |
| Median days open | 0 d | 58 d (−58 d vs this employer) |
| Median salary (USD postings) | — | $167k |
Skills observed across this category: 2.5D/3D, CoW, TSV, wafer process development, OSAT
Who's hiring in this category
- Micron Technology · 42 open roles · median 52 d
- KLA Corporation · 39 open roles · median 148 d
- Renesas Electronics · 22 open roles · median 23 d
- Intel Corporation · 20 open roles · median 40 d
- Lumilens · 13 open roles · median 91 d
- onsemi · 11 open roles · median 51 d
How we counted: 313 open Packaging Engineering (Advanced Packaging) roles from 64 employers tracked in the SemiconductorJobs index, counted 6 Nov 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.