Photonics Packaging Engineer

Originally posted July 25, 2026 by the employer.

About the role

Volantis Semiconductor is hiring a Photonics Packaging Engineer to contribute to and own aspects of the A-0 and A-1 packages. The position bridges photonics and advanced packaging skillsets across multi-die assemblies.

What you'll do

• Own aspects of the A-0 and A-1 package development.
• Bridge photonics and advanced packaging engineering disciplines across integrated assemblies.
• Contribute to multi-die integrated photonics package architectures.

What you'll need

• Experience with integrated photonics package assemblies with multiple dies.
• Experience with integrated circuit MCM assemblies with multiple heterogeneous materials, including compound semiconductors.
• Understanding of photonics concepts, such as mode field diameters, mode mismatch, and polarization.

Nice to have

• Experience with large device count photonic assemblies.
• Experience with clear underfill.
• Experience with high density fiber attach.
• Experience with large substrate size photonic MCM assemblies.
• Hands-on experience with PIC design.

Skills: integrated photonics, MCM assemblies, fiber attach, underfill, heterogeneous materials

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