Packaging Engineer (Process Module Development)
Originally posted 21 October 2026 by the employer.
About the role
This role is for a Process Module Engineer focused on material and process development within the Penang SSD Platform Technology Development Integration (PTDI) organization at SanDisk Storage Malaysia. You will develop SSD assembly and IC packaging materials and SMT processes to transition new SSD products to high-volume manufacturing.
What you'll do
- Define IC package, SMT, and SSD drive requirements, goals, and milestones across SSD product groups and customer specifications.
- Develop SSD assembly and IC packaging materials and processes to satisfy quality, reliability, cost, yield, productivity, and manufacturing requirements.
- Plan and conduct experiments (DOE) to characterize materials and processes from pathfinding through development and high-volume manufacturing ramp.
- Lead SMT material and process development, stencil design, DFM assessment, and NUDD risk management.
- Establish process control systems, product recipes, machine fingerprinting, and SMT AI/ML integration for stability predictability.
- Execute failure analysis using mechanical and material lab tools, while applying FMEA, 8D, DMAIC, and statistical analysis tools.
What you'll need
- Bachelor or Master degree in Mechanical, Electrical, Material Science, or Engineering.
- 5 years of relevant work experience within the semiconductor industry.
- Experience with IC packaging, SMT process qualification, and assembly material development.
- Working knowledge of quality and statistical tools such as FMEA, 8D, DMAIC, and JMP or Minitab.
Nice to have
- Track record of pathfinding and developing SMT materials such as paste and epoxy with vendors for factory qualification.
- Experience analyzing root causes through failure analysis reports (EDX, FTIR), simulation reports, mechanical (shadow moire) analysis reports, or metrology data.
- Hands-on experience with metrology and semiconductor failure analysis equipment.
- Experience with AI/ML and machine fingerprinting.
- Six Sigma GreenBelt or BlackBelt certification.
More semiconductor jobs: SanDisk jobs · Packaging engineer jobs · Malaysia jobs
This role has been open 0 days — well below the 64-day median for Packaging Engineering roles.
Packaging Engineering · Advanced Packaging
|
Open roles in category
297
|
Median days open
64 d
|
Category median salary (all employers)
$167k
|
See the full market breakdown ▾Category comparison, and who else is hiring
| Metric | SanDisk | All employers we track in this specialty (297 roles · 59 employers) |
|---|---|---|
| Open roles in this specialty | 6 | 297 |
| Open roles in the wider Process, Fab & Equipment family | 73 | 10091 · 105 employers |
| Median days open | 0 d | 64 d (−64 d vs this employer) |
| Median salary (USD postings) | — | $167k |
Who's hiring in this category
- KLA Corporation · 41 open roles · median 141 d
- Micron Technology · 41 open roles · median 45 d
- Intel Corporation · 20 open roles · median 54 d
- Renesas Electronics · 17 open roles · median 46 d
- GlobalFoundries · 14 open roles · median 73 d
- Lumilens · 13 open roles · median 84 d
How we counted: 297 open Packaging Engineering (Advanced Packaging) roles from 59 employers tracked in the SemiconductorJobs index, counted 30 Oct 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.