Principal Systems Packaging & Assembly Engineer
$180,000 - $240,000 USD yearly
About the role
Lead the development and integration of advanced packaging and assembly solutions for MEMS-based silicon photonics optical switching systems from concept through high-volume production. This role bridges device engineering, packaging architecture, manufacturing engineering, and supply chain across OSATs and internal teams.
What you'll do
- Define and co-design package substrates, leading package and assembly integration for systems combining MEMS devices, photonic ICs, ASICs, substrates, and optical interfaces.
- Drive mechanical, electrical, and optical integration strategies while collaborating across photonics, MEMS, electrical, and mechanical engineering teams.
- Optimize assembly processes including die attach, flip-chip, wire bonding, fiber attach/alignment, and hybrid integration.
- Develop fixtures, jigs, tooling, process flows, BOM structures, and manufacturing documentation at OSATs for prototype builds and NPI.
- Lead New Product Introduction (NPI), process qualification, yield ramp, reliability validation, and failure analysis (RCA) workflows.
- Manage direct technical engagements and technology transfer with OSATs, substrate vendors, optics suppliers, and contract manufacturers.
What you'll need
- Bachelor’s or Master’s degree in Mechanical Engineering, Electrical Engineering, Materials Science, or a related field.
- 15+ years of experience in semiconductor or photonics packaging engineering with IC package design and back-end assembly process development.
- Strong background in advanced packaging technologies, including flip-chip and wirebond hybrid assemblies, BGA / FCBGA / CSP / WLCSP, multi-die stacking (2.5D / 3D integration), and System-in-Package (SiP).
- Proven track record driving NPI programs from concept to high-volume production with hands-on OSAT and contract manufacturer management.
- Hands-on expertise with die bonders, dispensers, reflow/TCB tools, wirebonders, and interface metrology (CSAM, X-ray, AOI).
- Strong background in materials characterization and statistical process control (DOE, FMEA, SPC).
Nice to have
- Experience with fiber attach, photonic IC packaging, optical transceivers, co-packaged optics, or photonics modules.
- Experience with optical alignment and hermetic packaging solutions.
- Six Sigma certification.
- Familiarity with substrate layout tools and packaging design environments (Cadence SiP, AutoCAD, SolidWorks).
More semiconductor jobs: Packaging engineer jobs · Santa Clara jobs
This role has been open 0 days — well below the 64-day median for Packaging Engineering roles.
Packaging Engineering · Advanced Packaging
|
Open roles in category
295
|
Median days open
64 d
|
Category median salary (all employers)
$167k
|
See the full market breakdown ▾Category comparison, and who else is hiring
| Metric | nEye | All employers we track in this specialty (295 roles · 57 employers) |
|---|---|---|
| Open roles in this specialty | 3 | 295 |
| Open roles in the wider Process, Fab & Equipment family | 5 | 10088 · 116 employers |
| Median days open | 0 d | 64 d (−64 d vs this employer) |
| Median salary (USD postings) | — | $167k |
Who's hiring in this category
- Micron Technology · 42 open roles · median 49 d
- KLA Corporation · 39 open roles · median 145 d
- Intel Corporation · 20 open roles · median 47 d
- Renesas Electronics · 17 open roles · median 50 d
- Lumilens · 13 open roles · median 88 d
- onsemi · 12 open roles · median 48 d
How we counted: 295 open Packaging Engineering (Advanced Packaging) roles from 57 employers tracked in the SemiconductorJobs index, counted 3 Nov 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.