Senior Optical Packaging Engineer - Milpitas, California, United States
$160,000 USD yearly
Originally posted 3 December 2025 by the employer.
About the role
The Senior Optical Packaging Engineer is responsible for developing and implementing a high-performance, robust fiber-to-chip package and a scalable packaging process for optical systems comprised of optical fibers attached to photonic integrated circuits.
What you'll do
- Develop an optical package and fiber-to-chip alignment scheme for high alignment accuracy and scalable assembly. - Develop packaging prototypes, scalable fiber-to-chip packaging flows, and NPI processes while reviewing packaging design BOMs and coordinating with supply chain on procurement. - Establish and update version-controlled DFM requirements to feed back to the packaging design group. - Design, execute, summarize, and analyze experiments and process trend studies to improve performance and reliability of optical packaged assemblies. - Collaborate with manufacturing teams and external vendors on transferring and scaling packaging designs, setting up high-throughput assembly lines, and sourcing required materials.
What you'll need
- Master’s degree or above in Engineering, Physics, or Material Science. - 10+ years of experience with or at a semiconductor company or supplier working on PIC packaging design, qualification, and multi-chip assemblies. - 5+ years of experience working with optical fibers and optical measurements. - 5+ years of work experience with advanced semiconductor packaging OSAT (Outsourced Semiconductor Assembly & Test) and/or EOL vendors. - 5+ years of experience with a semiconductor company or supplier working on FAU / optical connector to chip attachment. - Experience with fiber attach tooling, process/flow development, and optical data analysis. - Experience with FA and 8D failure resolution techniques, as well as yield and quality metrics development for reliability based on optical and mechanical performance.
This role has been open 0 days — well below the 53-day median for Hardware Systems Engineering roles.
Hardware Systems Engineering · AI ML Hardware
|
Open roles in category
1022
|
Median days open
53 d
|
Median salary
$155k
|
See the full market breakdown ▾Category comparison, and who else is hiring
| Metric | PsiQuantum | All employers we track in this specialty (1022 roles · 100 employers) |
|---|---|---|
| Open roles in this specialty | 18 | 1022 |
| Open roles in the wider Software, Firmware & Systems family | 34 | 6391 · 148 employers |
| Median days open | 126 d | 53 d (+73 d vs this employer) |
| Median salary (USD postings) | — | $155k |
Who's hiring in this category
- Intel Corporation · 76 open roles · median 40 d
- KLA Corporation · 63 open roles · median 54 d
- Teradyne · 58 open roles · median 40 d
- Applied Materials · 49 open roles · median 68 d
- NVIDIA · 49 open roles · median 71 d
- AMD · 43 open roles · median 57 d
How we counted: 1022 open Hardware Systems Engineering (AI ML Hardware) roles from 100 employers tracked in the SemiconductorJobs index, counted 28 Oct 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Software, Firmware & Systems family row. Figures refresh nightly.