Thermal & Mechanical Engineer, Annapurna Labs - AI Silicon Packaging
About the role
As a member of the Machine Learning Acceleration team at Annapurna Labs, you will be responsible for the thermal and mechanical integrity, design, and optimization of semiconductor packaging hardware in data centers.
What you'll do
- Perform finite element simulations and analytical modeling to evaluate assembly, test, and reliability risks for advanced semiconductor packages.
- Design and execute experiments on materials and packaging or system structures to validate performance and inform design decisions.
- Develop risk evaluations for future Annapurna packages, delivering data-driven recommendations for package designs.
- Collaborate with Quality and Reliability, Package Design, Test, and System Design teams to optimize package architectures and resolve cross-functional technical challenges.
- Communicate findings through clear documentation and design reviews, contributing to specifications and trade-off analyses that guide team decisions.
What you'll need
- Experience performing finite element simulations and analytical modeling for semiconductor packages.
- Experience designing and executing experiments on materials and packaging or system structures under thermal cycling.
- Experience evaluating assembly, test, and reliability risks for packaging architectures.
More semiconductor jobs: Hardware design jobs · Austin jobs
This role has been open 0 days — well below the 48-day median for Hardware Systems Engineering roles.
Hardware Systems Engineering · AI ML Hardware
|
Open roles in category
1054
|
Median days open
48 d
|
Category median salary (all employers)
$153k
|
See the full market breakdown ▾Category comparison, and who else is hiring
| Metric | Amazon | All employers we track in this specialty (1054 roles · 101 employers) |
|---|---|---|
| Open roles in this specialty | 4 | 1054 |
| Open roles in the wider Software, Firmware & Systems family | 6 | 6269 · 144 employers |
| Median days open | 16 d | 48 d (−32 d vs this employer) |
| Median salary (USD postings) | — | $153k |
Who's hiring in this category
- Intel Corporation · 78 open roles · median 42 d
- Teradyne · 61 open roles · median 42 d
- KLA Corporation · 60 open roles · median 54 d
- Applied Materials · 51 open roles · median 59 d
- NVIDIA · 49 open roles · median 65 d
- ASML · 46 open roles · median 26 d
How we counted: 1054 open Hardware Systems Engineering (AI ML Hardware) roles from 101 employers tracked in the SemiconductorJobs index, counted 30 Oct 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Software, Firmware & Systems family row. Figures refresh nightly.