Technologist, Packaging Engineering
$153,600 - $261,100 USD yearly
Originally posted 12 September 2026 by the employer.
About the role
As a Technologist, Packaging Engineering in Milpitas, you will set technical direction and provide end-to-end ownership of the package lifecycle across design, development, qualification, and high-volume manufacturing.
What you'll do
- Serve as senior package engineering representative on cross-functional leadership teams, ensuring packages are characterized, qualified, and released to production to meet mechanical, electrical, performance, reliability, and quality standards.
- Partner with global factories, contract manufacturers, and packaging R&D organizations to introduce and qualify new package designs, advanced assembly processes, and packaging technologies.
- Drive assembly yield improvement initiatives, package cost-reduction programs, package technology roadmaps, and infrastructure budgets across supported product lines.
- Guide products from low-volume to high-volume manufacturing while enforcing readiness of FMEA, SOD, Control Plans, process recipes, and SPC.
- Lead technical evaluation of design options via characterization builds and DFX analyses (DFM, DFA, DFRW) to influence product architecture and system-level manufacturing strategy.
What you'll need
- Master’s degree with 10+ years of relevant experience, or PhD with 8+ years of experience in Material Science, Manufacturing, Mechanical Engineering, Computer Science, Physics, or related engineering discipline.
- Proficient understanding of packaging domains including SMT, PCBA, solder joint reliability, board-level reliability, packaging materials, failure analysis, and PCB layout.
- Experience with machine learning and data analytics utilizing AI technologies.
- Knowledge of thermo-mechanical aspects of semiconductor packages and Solid-State Drives.
- Demonstrated expertise in experimental design and statistical analysis.
Nice to have
- Additional expertise in die attach, wire bonding, wafer thinning, and molding processes.
- Demonstrated experience mentoring or managing junior engineers.
Skills: package qualification, SMT, PCBA, DFX, solder joint reliability
More semiconductor jobs: SanDisk jobs · Packaging engineer jobs · California jobs
This role has been open 0 days — well below the 46-day median for Packaging Engineering roles.
Packaging Engineering · Packaging
|
Open roles in category
250
|
Median days open
46 d
|
Category median salary (all employers)
$166k
|
See the full market breakdown ▾Category comparison, skills in demand, and who else is hiring
| Metric | SanDisk | All employers we track in this specialty (250 roles · 45 employers) |
|---|---|---|
| Open roles in this specialty | 13 | 250 |
| Open roles in the wider Process, Fab & Equipment family | 146 | 10155 · 105 employers |
| Median days open | 0 d | 46 d (−46 d vs this employer) |
| Median salary (USD postings) | — | $166k |
Skills observed across this category: package qualification, SMT, PCBA, DFX, solder joint reliability
Who's hiring in this category
- Renesas Electronics · 31 open roles · median 39 d
- Infineon Technologies · 26 open roles · median 42 d
- Micron Technology · 20 open roles · median 79 d
- onsemi · 15 open roles · median 35 d
- Skyworks · 15 open roles · median 3 d
- Intel Corporation · 12 open roles · median 71 d
How we counted: 250 open Packaging Engineering (Packaging) roles from 45 employers tracked in the SemiconductorJobs index, counted 30 Oct 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.