Senior Staff Packaging Engineer
$153,600 - $261,100 USD yearly
Focus on Cu-Cu hybrid bonding, TSV processing, and high-layer-count NAND die stacking for advanced 3D packaging.
Originally posted 10 November 2026 by the employer.
About the role
This role is part of the Advanced 3D Packaging technology team focusing on memory packaging solutions for AI inference in data center, mobile, and other platforms. Scope covers module engineering, process technology integration, materials and equipment integration, and yield and reliability analysis through development and qualification.
What you'll do
- Develop and optimize advanced packaging processes, including high-layer-count NAND die stacking, TSV, micro-bump, Cu-Cu hybrid bonding, and base-die/logic-die integration.
- Lead process integration across wafer thinning, wafer-level packaging, RDL, substrate, assembly, and test for NAND die stacks.
- Direct advanced packaging design and product-level integration for multi-die stacks, balancing front-end and back-end constraints for product yield, cost, quality, and manufacturability.
- Evaluate and qualify advanced materials used in 3D hybrid package integration.
- Partner with external sources such as foundries, OSATs, substrate suppliers, equipment vendors, and material suppliers to support multi-source readiness.
- Drive DOE, process characterization, yield learning, and reliability improvements from R&D to pilot line and high-volume manufacturing.
What you'll need
- MS or PhD in Materials Science, Electrical/Mechanical/Chemical Engineering, Physics, or a related field.
- 5 to 7+ years of experience in semiconductor process development/integration or design in advanced packaging and/or wafer processing.
- Hands-on experience in one or more of: NAND or DRAM die stacking, TSV processing, hybrid bonding, wafer-level packaging (WLP/FOWLP), advanced substrate technology, 2.5D/3D integration, or materials integration.
- Process integration fundamentals and data-driven problem solving using DOE, SPC, or AI-enhanced development methodologies.
- Experience working with third parties and suppliers such as OSATs, foundries, memory assembly/test operations, materials vendors, FA/test tools, and metrology.
Nice to have
- Direct HBM or high-layer-count 3D NAND packaging development experience.
- Package reliability, thermo-mechanical modeling, and failure analysis background.
- Track record taking a technology from concept through qualification to production.
- Operational experience transitioning a program from development into manufacturing, including setting up integrated development lines.
- Experience leading global cross-functional teams and external development partners.
- Multilingual skills in English and Asian languages.
More semiconductor jobs: SanDisk jobs · Process engineer jobs · California jobs
First seen in our index 0 days ago, well below the 45-day median for Process Integration roles.
Process Integration · Advanced Packaging
|
Open roles in category
93
|
Median days since first seen
45 d
|
Category median salary (all employers)
$171k
|
See the full market breakdown ▾Category comparison, and who else is hiring
| Metric | SanDisk | All employers we track in this specialty (93 roles · 23 employers) |
|---|---|---|
| Open roles in this specialty | 4 | 93 |
| Open roles in the wider Process, Fab & Equipment family | 131 | 10178 · 116 employers |
| Median days since first seen | 1 d | 45 d (+44 d vs this employer) |
| Median salary (USD postings) | n/a | $171k |
Who's hiring in this category
- Micron Technology · 19 open roles · median 46 d
- SkyWater Technology · 12 open roles · median 20 d
- Intel Corporation · 11 open roles · median 119 d
- Applied Materials · 10 open roles · median 54 d
- GlobalFoundries · 10 open roles · median 108 d
- Renesas Electronics · 5 open roles · median 56 d
How we counted: 93 open Process Integration (Advanced Packaging) roles from 23 employers tracked in the SemiconductorJobs index, counted 10 Nov 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there, and is counted in the wider Process, Fab & Equipment family row. Days are counted from when our index first saw each posting, not from the employer's original posting date.