Own packaging process development and NPI qualification for EPYC server products.
Originally posted 10 November 2026 by the employer.
About the role
This role drives package process development and product new product introduction (NPI) for AMD's EPYC server products. You will own product and test vehicle package development and qualification activities working with cross-functional teams and external suppliers.
What you'll do
- Define test-vehicle and product-package execution plans with cross-functional teams.
- Support technology development and product NPI to meet key milestones with internal partners and external suppliers.
- Identify technical and schedule risks, and develop and implement mitigation plans.
- Troubleshoot and resolve issues affecting schedule, yield, reliability, and process robustness.
- Collect, analyze, and present data to drive technical decisions and continuous improvement.
- Collaborate with material/equipment suppliers, OSATs, foundries, and ecosystem partners.
What you'll need
- Proven experience in semiconductor packaging development, especially for advanced server products.
- Experience driving cross-functional projects with internal teams and external suppliers.
- Track record in yield improvement, reliability, and process development.
- Written and verbal communication skills with the ability to present complex technical information to diverse audiences.
- BS, MS, or PhD in Mechanical Engineering, Material Science, Electrical Engineering, Chemical Engineering, or equivalent.
Nice to have
- Hands-on experience with advanced packaging, wafer-level assembly, substrate assembly, RDL, bumping, composite materials, and polymers.
- Experience working directly with OSATs, material/equipment suppliers, and foundry partners.
- Experience managing NPI schedules and qualifications.
More semiconductor jobs: AMD jobs · Process engineer jobs · Texas jobs
First seen in our index 0 days ago, well below the 45-day median for Process Integration roles.
Process Integration · Advanced Packaging
|
Open roles in category
96
|
Median days since first seen
45 d
|
Category median salary (all employers)
$171k
|
See the full market breakdown ▾Category comparison, and who else is hiring
| Metric | AMD | All employers we track in this specialty (96 roles · 24 employers) |
|---|---|---|
| Open roles in this specialty | 3 | 96 |
| Open roles in the wider Process, Fab & Equipment family | 60 | 10212 · 116 employers |
| Median days since first seen | 0 d | 45 d (+45 d vs this employer) |
| Median salary (USD postings) | n/a | $171k |
Who's hiring in this category
- Micron Technology · 19 open roles · median 47 d
- Intel Corporation · 11 open roles · median 120 d
- SkyWater Technology · 11 open roles · median 21 d
- Applied Materials · 10 open roles · median 55 d
- GlobalFoundries · 10 open roles · median 109 d
- Renesas Electronics · 5 open roles · median 57 d
How we counted: 96 open Process Integration (Advanced Packaging) roles from 24 employers tracked in the SemiconductorJobs index, counted 11 Nov 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there, and is counted in the wider Process, Fab & Equipment family row. Days are counted from when our index first saw each posting, not from the employer's original posting date.