Advanced Packaging Engineer
$250,000 USD yearly
Originally posted July 23, 2026 by the employer.
About the role
You will contribute to and own aspects of the Volantis A-0 and A-1 wafer-scale package integrating silicon and compound semiconductor dies at high TDP.
What you'll do
- Own and contribute to package design or package process development for the Volantis A-0 and A-1 platforms.
- Solve engineering challenges involving warpage, CTE mismatch, and thermomechanical constraints across complex assemblies.
- Address assembly speed and manufacturing challenges for wafer-scale packaging platforms up to 56x reticle sizes.
- Evaluate and apply first-principles engineering solutions to novel packaging architectures combining silicon and compound semiconductors.
What you'll need
- Background in package design or package process development of complex packages.
- Demonstrated ability to analyze and solve novel packaging problems from first principles rather than relying strictly on legacy design boundaries.
Nice to have
- Experience with heterogeneous material assemblies.
- Experience with high-TDP packages.
- Experience with compound semiconductor assemblies.
- Experience with co-packaged optics.
- Experience working with architects to co-design system architecture and package design.
- Experience with interposer platforms such as CoWoS, CoWoS-L, CoWoS-R, EMIB, FoCoS, or FoCoS-Bridge.
- Experience with flip-chip integration, especially mass reflow, TCB, and LAB.
- Experience with large-scale (>50x50mm) substrates.
Skills: wafer-scale package, heterogeneous integration, warpage, CoWoS, interposer
More semiconductor jobs: Advanced packaging jobs
First seen in our index 0 days ago, well below the 49-day median for Chiplet/Advanced Packaging Design roles.
Chiplet/Advanced Packaging Design · Advanced Packaging
|
Open roles in category
79
|
Median days since first seen
49 d
|
Category median salary (all employers)
$189k
|
See the full market breakdown ▾Category comparison, skills in demand, and who else is hiring
| Metric | Volantis Semiconductor | All employers we track in this specialty (79 roles · 29 employers) |
|---|---|---|
| Open roles in this specialty | 1 | 79 |
| Median days since first seen | 0 d | 49 d (+49 d vs this employer) |
| Median salary (USD postings) | n/a | $189k |
Skills observed across this category: wafer-scale package, heterogeneous integration, warpage, CoWoS, interposer
Who's hiring in this category
- AMD · 11 open roles · median 30 d
- Micron Technology · 11 open roles · median 195 d
- Marvell Technology · 7 open roles · median 45 d
- NVIDIA · 6 open roles · median 67 d
- Qualcomm · 6 open roles · median 58 d
- Intel Corporation · 4 open roles · median 51 d
How we counted: 79 open Chiplet/Advanced Packaging Design (Advanced Packaging) roles from 29 employers tracked in the SemiconductorJobs index, counted 14 Nov 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there. Days are counted from when our index first saw each posting, not from the employer's original posting date.