Semiconductor Packaging Process Engineering Lead
$155,520 - $298,440 USD yearly
This role leads engineering efforts within the Epoxy Mold Module division, deploying and optimizing semiconductor packaging assembly processes and equipment.
Originally posted 13 November 2026 by the employer.
About the role
This role leads an engineering team responsible for advancing semiconductor packaging processes and introducing new equipment within a 24x7 manufacturing environment. The position sits within the Epoxy Mold Module division in Arizona.
What you'll do
- Lead, mentor, and develop a team of engineers across a 24x7 operation, managing shift engineering coverage.
- Guide the deployment, implementation, and optimization of new packaging equipment and process technologies into the manufacturing environment.
- Direct equipment and process specifications to align with operational goals and manufacturing expectations.
- Build partnerships across manufacturing, automation, and partner engineering groups.
- Formulate strategies to improve manufacturing efficiency, yield, throughput, and overall process manufacturability.
What you'll need
- Bachelor’s Degree in Materials Science, Mechanical Engineering, Electrical Engineering, Chemical Engineering, Physics, or related STEM field with 6+ years of relevant experience, or a Master’s Degree with 4+ years, or a PhD with 2+ years.
- Experience developing, qualification testing, or releasing semiconductor packaging assembly processes.
- Professional ownership of DOE (Design of Experiments), SPC (Statistical Process Control), or JMP/Minitab data modeling to resolve process anomalies or optimize yields.
Nice to have
- 4+ years of experience in Semiconductor Assembly Process Technology Development (TD), leading processes from pathfinding through to high-volume manufacturing (HVM) transfer.
- Direct people management or formal team leadership experience, including ownership of performance reviews, career development plans, and team resource allocation.
- Experience working directly with, configuring, or troubleshooting automated fluid dispense systems, thermal curing/bonding ovens, plasma treatment chambers, or optical/acoustic metrology tools.
- Experience initiating or influencing equipment development roadmaps or technical supplier specifications.
- Track record of leading cross-functional projects with Automation, Yield, or Quality teams to improve yield, reduce defect rates, or optimize throughput.
More semiconductor jobs: Intel Corporation jobs · Packaging engineer jobs · Arizona jobs
First seen in our index 0 days ago, well below the 60-day median for Packaging Engineering roles.
Packaging Engineering · Advanced Packaging
|
Open roles in category
328
|
Median days since first seen
60 d
|
Category median salary (all employers)
$167k
|
See the full market breakdown ▾Category comparison, and who else is hiring
| Metric | Intel Corporation | All employers we track in this specialty (328 roles · 65 employers) |
|---|---|---|
| Open roles in this specialty | 25 | 328 |
| Open roles in the wider Process, Fab & Equipment family | 233 | 10410 · 119 employers |
| Median days since first seen | 28 d | 60 d (+32 d vs this employer) |
| Median salary (USD postings) | n/a | $167k |
Who's hiring in this category
- Micron Technology · 45 open roles · median 57 d
- KLA Corporation · 39 open roles · median 153 d
- Intel Corporation (this employer) · 24 open roles · median 35 d
- Renesas Electronics · 23 open roles · median 37 d
- Lumilens · 13 open roles · median 98 d
- AMD · 12 open roles · median 43 d
How we counted: 328 open Packaging Engineering (Advanced Packaging) roles from 65 employers tracked in the SemiconductorJobs index, counted 13 Nov 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there, and is counted in the wider Process, Fab & Equipment family row. Days are counted from when our index first saw each posting, not from the employer's original posting date.