Principal Packaging Engineer, Optical Interfaces

Develop active and passive optical interfacing and fiber coupling processes for MEMS-based silicon photonics optical circuit switches.

About the role

The Principal Packaging Engineer, Optical Interfaces leads the development of silicon photonics packaging solutions, serving as the primary architect for optical interfacing processes. In this hands-on technical role, you own the optical and mechanical interface processes from collaborative design through implementation and optimization with contract manufacturing partners.

What you'll do

• Design and develop high-yield processes for active and passive optical interfaces to photonic integrated circuits (PICs), specializing in methods for stable fiber coupling.
• Collaborate with integrated circuit (IC) and mechanical design teams to define structures that minimize stress, ensure thermal stability, and enhance package reliability.
• Serve as the primary technical interface with contract manufacturing partners to coordinate process design, implementation, characterization, and high-volume production transfer.
• Define and manage critical process controls, alignment tolerances, and metrology methods, while analyzing yield data for continuous process improvement.
• Define and execute test methodologies to characterize packaged device reliability under environmental and mechanical stresses.
• Apply thermal, modal, and stress/strain principles to predict and mitigate packaging reliability risks and resolve failure modes.

What you'll need

• Bachelor's, Master's, or Ph.D. in Mechanical Engineering, Materials Science, Optical Engineering, or a related field.
• 10+ years of hands-on experience in packaging design for optical or photonic components.
• Direct experience with PIC optical edge coupling, including proficiency with active and passive alignment techniques, as well as edge-coupling product development and introduction.
• In-depth knowledge of packaging materials, including optical adhesives and epoxies, their design constraints, and their application in high-reliability environments.
• Experience collaborating with contract manufacturers to design, implement, and ramp packaging processes to volume production.
• Strong understanding of reliability engineering principles, packaging failure mechanisms, and relevant testing standards such as Telcordia.
• Experience with CAD tools for mechanical design and packaging layouts.

Nice to have

• Familiarity with various waveguide technologies and their impact on packaging design.
• Knowledge of semiconductor fabrication processes and their constraints on packaging.
• Experience with Finite Element Analysis (FEA) software for stress, thermal, or modal simulations.

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