Senior Principal Packaging Engineer - Morgan Hill, CA, United States
Originally posted 12 October 2026 by the employer.
Packaging development for Lightwave products including TO-cans, TOSA/ROSA, and Chip on Carrier.
About the role
Responsible for managing an engineering group overseeing all aspects of packaging for Lightwave products, including TO-cans, TOSA/ROSA, and Chip on Carrier. The position oversees packaging development activities, drives continuous improvement, and supports sustaining existing technologies.
What you'll do
- Serve as the primary interface for package design and improvements between external suppliers and internal design teams across the Lightwave BU. - Guide the correlation of package design architecture to assembly process constraints, resolving yield and reliability problems with cross-functional teams. - Deliver design rule decks, lead DFM/DFR activities, and oversee substrate fabrication, package assembly, and package qualification with external partners. - Collaborate with the photonics design team to optimize performance, reliability, and manufacturability. - Manage existing TO-can engineers in Taiwan and China, and coach/mentor process engineers on root cause analysis. - Design and develop new packaging techniques to support new product introduction, driving yield improvement, cost reduction, and process controls with contract manufacturers.
What you'll need
- Strong understanding of packaging fundamentals including assembly process constraints, substrate fabrication, and package qualification. - Experience with packaging architectures such as TO-cans, TOSA/ROSA, and Chip on Carrier. - Demonstrated experience leading DFM and DFR activities for package designs. - Track record of managing or mentoring packaging/process engineers and working with contract manufacturers. - Experience collaborating with photonics design teams on manufacturability, performance, and reliability optimization.
Skills: package design, DFM, photonics, TO-can, assembly
This role has been open 0 days — well below the 57-day median for Packaging Engineering roles.
Packaging Engineering · Packaging
|
Open roles in category
220
|
Median days open
57 d
|
Median salary
$165k
|
See the full market breakdown ▾Category comparison, skills in demand, and who else is hiring
| Metric | MACOM | All employers we track in this specialty (220 roles · 42 employers) |
|---|---|---|
| Open roles in this specialty | 8 | 220 |
| Open roles in the wider Process, Fab & Equipment family | 90 | 10278 · 109 employers |
| Median days open | 0 d | 57 d (−57 d vs this employer) |
| Median salary (USD postings) | — | $165k |
Skills observed across this category: package design, DFM, photonics, TO-can, assembly
Who's hiring in this category
- Renesas Electronics · 31 open roles · median 37 d
- Infineon Technologies · 25 open roles · median 36 d
- Micron Technology · 20 open roles · median 77 d
- onsemi · 16 open roles · median 33 d
- Skyworks · 12 open roles · median 10 d
- Intel Corporation · 11 open roles · median 112 d
How we counted: 220 open Packaging Engineering (Packaging) roles from 42 employers tracked in the SemiconductorJobs index, counted 28 Oct 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.