Advanced Packaging Development Engineer
Focus on 2.5D and 3D packaging integration involving hybrid bonding, interposers, and Through-Silicon Vias (TSVs).
About the role
Apple’s Advanced Packaging team is seeking a Packaging Development Engineer to drive packaging integration and technology development for future products. This role focuses on 2.5D and 3D packaging technologies incorporating hybrid bonding, high-density interposers, fine-pitch microbumps, and Through-Silicon Vias (TSVs).
What you'll do
- Lead the definition, development, and qualification of 2.5D and 3D packaging technologies.
- Integrate features including hybrid bonding, high-density interposers, fine-pitch microbumps, and Through-Silicon Vias (TSVs).
- Collaborate cross-functionally with silicon design, physical design, SI/PI, thermal, and manufacturing teams from early architecture exploration through qualification and high-volume manufacturing.
- Drive novel 2.5D/3D package integration and technology development architectures from early concept through qualification.
What you'll need
- Bachelor’s degree in Physics, Materials Science, Electrical Engineering, Mechanical Engineering, Computer Engineering, or a related technical discipline.
Nice to have
- Strong technical background in 2.5D/3D packaging and semiconductor integration schemes, including hybrid bonding, interposers, fine-pitch microbumps, and TSVs.
- Solid grasp of fab BEoL/MEoL interconnect processing, wafer-level packaging, and advanced assembly flows.
- Understanding of packaging materials, thermo-mechanical reliability, and chip-package interaction failure mechanisms.
- Ability to balance package-level choices against silicon, electrical, thermal, and manufacturing constraints.
- Experience utilizing layout, physical design, or modeling tools alongside engineering data analysis.
- Proven track record collaborating with and driving external foundries, OSATs, or material vendors.
Skills: 2.5D/3D Packaging, Hybrid Bonding, TSV, Interposers, Wafer-Level Packaging
More semiconductor jobs: Apple jobs · Packaging engineer jobs
First seen in our index 0 days ago, well below the 61-day median for Packaging Engineering roles.
Packaging Engineering · Advanced Packaging
|
Open roles in category
324
|
Median days since first seen
61 d
|
Category median salary (all employers)
$167k
|
See the full market breakdown ▾Category comparison, skills in demand, and who else is hiring
| Metric | Apple | All employers we track in this specialty (324 roles · 64 employers) |
|---|---|---|
| Open roles in this specialty | 4 | 324 |
| Open roles in the wider Process, Fab & Equipment family | 15 | 10220 · 116 employers |
| Median days since first seen | 10 d | 61 d (+51 d vs this employer) |
| Median salary (USD postings) | n/a | $167k |
Skills observed across this category: 2.5D/3D Packaging, Hybrid Bonding, TSV, Interposers, Wafer-Level Packaging
Who's hiring in this category
- Micron Technology · 43 open roles · median 57 d
- KLA Corporation · 38 open roles · median 152 d
- Intel Corporation · 23 open roles · median 33 d
- Renesas Electronics · 23 open roles · median 35 d
- Lumilens · 13 open roles · median 96 d
- Infineon Technologies · 11 open roles · median 52 d
How we counted: 324 open Packaging Engineering (Advanced Packaging) roles from 64 employers tracked in the SemiconductorJobs index, counted 11 Nov 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there, and is counted in the wider Process, Fab & Equipment family row. Days are counted from when our index first saw each posting, not from the employer's original posting date.