EPYC server products packaging integration and NPI.
Originally posted 10 November 2026 by the employer.
About the role
This role drives package process development and product NPI for AMD's EPYC server products. You will own product and test vehicle package planning, development, and qualification activities working with cross-functional teams and external suppliers.
What you'll do
- Define test-vehicle and product-package designs and create execution plans with cross-functional teams.
- Lead technology development and product NPI, coordinating milestones across geographies and suppliers.
- Identify technical and schedule risks, and develop and implement mitigation plans.
- Troubleshoot and resolve issues affecting schedule, yield, reliability, and process robustness.
- Collect, analyze, and present data to drive technical decisions and continuous improvement.
- Collaborate with material/equipment suppliers, OSATs, foundries, and ecosystem partners.
What you'll need
- Proven experience in semiconductor packaging development, especially for advanced server products.
- Demonstrated leadership driving cross-functional projects with internal teams and external suppliers.
- Track record in yield improvement, reliability, and process development.
- BS, MS, or PhD in Mechanical Engineering, Material Science, Electrical Engineering, Chemical Engineering, or equivalent.
Nice to have
- Hands-on experience with advanced 3D and 2.5D package structures, wafer-level assembly, substrate assembly, RDL, bumping, composite materials, and polymers.
- Experience working directly with OSATs, material/equipment suppliers, and foundry partners.
- Experience leading global project teams and managing NPI schedules and qualifications.
Skills: 2.5D, 3D packaging, NPI, RDL, bumping, OSAT
More semiconductor jobs: AMD jobs · Packaging engineer jobs · California jobs
First seen in our index 0 days ago, well below the 61-day median for Packaging Engineering roles.
Packaging Engineering · Advanced Packaging
|
Open roles in category
324
|
Median days since first seen
61 d
|
Category median salary (all employers)
$167k
|
See the full market breakdown ▾Category comparison, skills in demand, and who else is hiring
| Metric | AMD | All employers we track in this specialty (324 roles · 64 employers) |
|---|---|---|
| Open roles in this specialty | 11 | 324 |
| Open roles in the wider Process, Fab & Equipment family | 60 | 10213 · 116 employers |
| Median days since first seen | 48 d | 61 d (+13 d vs this employer) |
| Median salary (USD postings) | n/a | $167k |
Skills observed across this category: 2.5D, 3D packaging, NPI, RDL, bumping, OSAT
Who's hiring in this category
- Micron Technology · 43 open roles · median 57 d
- KLA Corporation · 38 open roles · median 152 d
- Intel Corporation · 23 open roles · median 33 d
- Renesas Electronics · 23 open roles · median 35 d
- Lumilens · 13 open roles · median 96 d
- Infineon Technologies · 11 open roles · median 52 d
How we counted: 324 open Packaging Engineering (Advanced Packaging) roles from 64 employers tracked in the SemiconductorJobs index, counted 11 Nov 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there, and is counted in the wider Process, Fab & Equipment family row. Days are counted from when our index first saw each posting, not from the employer's original posting date.