Senior Packaging Engineer
Focus on Solid-State Drive (SSD) mechanical assembly, tooling design, and factory DFMA in Batu Kawan.
Originally posted 3 September 2026 by the employer.
About the role
The Senior Packaging Engineer evaluates and executes mechanical packaging and assembly processes for Solid-State Drive (SSD) products. The role focuses on factory Design for Mechanical Assembly and Automation (DFMA), tooling development, and product qualification.
What you'll do
- Conduct commonality analyses across product design, processes, machinery, materials, and measurement methodologies, executing Root Cause Corrective Action (RCCA) initiatives.
- Design and implement engineering Design of Experiments (DOEs) and apply advanced statistical analysis methods for data-driven problem solving.
- Execute factory DFMA evaluations for SSD assembly by reviewing Design Packages, tolerance stack-up analyses, and DFMEA.
- Design SSD assembly jigs and fixtures by creating new concepts, performing reverse engineering, and producing mechanical drawings.
- Develop and implement Product Qualification Packages, covering product specifications, packaging requirements, mechanical drawings, supplier DFM guidelines, and Quality Management Plans (QMP).
- Lead specialized engineering characterization activities, drive cost reduction projects, and support factory emergency taskforce operations.
What you'll need
- Bachelor's Degree in Mechanical Engineering or a related engineering or science discipline.
- 3 to 8 years of professional engineering experience within the semiconductor and automation industry.
- Demonstrated expertise in designing and executing Design of Experiments (DOE).
- Advanced proficiency in quality management tools (FMEA, 8D, DMAIC) and statistical analysis software (JMP, Minitab).
- Expert-level proficiency in SolidWorks CAD software.
- Hands-on experience with technical equipment and processes, including metrology and failure analysis techniques.
Nice to have
- Understanding of common mechanical commodities used in the semiconductor industry, including metals, plastics, rubbers, and adhesives.
- Knowledge of manufacturing processes and tooling construction for mechanical commodities, including CNC milling, stamping, bending, injection molding, die casting, and extrusion.
- Familiarity with SolidWorks Flow Simulation.
More semiconductor jobs: SanDisk jobs · Packaging engineer jobs · Malaysia jobs
This role has been open 0 days — well below the 64-day median for Packaging Engineering roles.
Packaging Engineering · Advanced Packaging
|
Open roles in category
297
|
Median days open
64 d
|
Category median salary (all employers)
$167k
|
See the full market breakdown ▾Category comparison, and who else is hiring
| Metric | SanDisk | All employers we track in this specialty (297 roles · 59 employers) |
|---|---|---|
| Open roles in this specialty | 6 | 297 |
| Open roles in the wider Process, Fab & Equipment family | 73 | 10091 · 105 employers |
| Median days open | 0 d | 64 d (−64 d vs this employer) |
| Median salary (USD postings) | — | $167k |
Who's hiring in this category
- KLA Corporation · 41 open roles · median 141 d
- Micron Technology · 41 open roles · median 45 d
- Intel Corporation · 20 open roles · median 54 d
- Renesas Electronics · 17 open roles · median 46 d
- GlobalFoundries · 14 open roles · median 73 d
- Lumilens · 13 open roles · median 84 d
How we counted: 297 open Packaging Engineering (Advanced Packaging) roles from 59 employers tracked in the SemiconductorJobs index, counted 30 Oct 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.