Packaging Module Engineering Technician
$51,710 - $99,770 USD yearly
About the role
This fully on-site Packaging Module Engineering Technician role supports advanced packaging technology development by preparing samples, running analytical testing, and evaluating materials. You will work with research engineers to generate analytical data that informs semiconductor process optimization, quality control, and failure analysis.
What you'll do
- Perform materials characterization and analysis using microscopy, imaging, acoustic inspection, and other analytical techniques.
- Prepare samples and coupons for testing using cross-sectioning, polishing, etching, ion milling, spin coating, and related methods.
- Operate characterization and test equipment including SEM/EDS, CSAM/TSAM, optical microscopy, elemental analysis, and mechanical testing systems.
- Support material evaluations, process development activities, and failure analysis investigations.
- Maintain laboratory equipment through routine maintenance, calibration, and basic troubleshooting.
- Perform chemical handling, wet processing, and laboratory testing in alignment with environmental health and safety (EHS) requirements.
What you'll need
- An Associate degree or Bachelor's degree in a STEM-related discipline (no prior professional experience required), OR a High School Diploma/GED with 1+ years of experience in material characterization, sample preparation, laboratory testing, or failure analysis.
- Experience with sample preparation or laboratory testing protocols.
- Ability to perform chemical handling, wet processing, and work within laboratory safety standards.
Nice to have
- 1+ years of experience operating analytical and characterization equipment such as SEM/EDS, optical microscopy, or CSAM/TSAM equipment.
- Experience with sample preparation techniques including cross-sectioning, polishing, etching, ion milling, water-jet cutting, or spin coating.
- Experience supporting semiconductor packaging, materials characterization, failure analysis, or process development activities.
- Experience with mechanical testing techniques such as button shear, die pull, or related material evaluation methods.
- Experience collecting, documenting, and analyzing technical data in a laboratory or engineering environment.
More semiconductor jobs: Intel Corporation jobs · Hardware design jobs · Arizona jobs
This role has been open 0 days — well below the 47-day median for Hardware Systems Engineering roles.
Hardware Systems Engineering · AI ML Hardware
|
Open roles in category
1103
|
Median days open
47 d
|
Category median salary (all employers)
$150k
|
See the full market breakdown ▾Category comparison, and who else is hiring
| Metric | Intel Corporation | All employers we track in this specialty (1103 roles · 111 employers) |
|---|---|---|
| Open roles in this specialty | 85 | 1103 |
| Open roles in the wider Software, Firmware & Systems family | 241 | 6481 · 156 employers |
| Median days open | 31 d | 47 d (−16 d vs this employer) |
| Median salary (USD postings) | — | $150k |
Who's hiring in this category
- Intel Corporation (this employer) · 81 open roles · median 31 d
- KLA Corporation · 63 open roles · median 59 d
- NVIDIA · 58 open roles · median 71 d
- Teradyne · 56 open roles · median 48 d
- Applied Materials · 54 open roles · median 50 d
- ASML · 52 open roles · median 27 d
How we counted: 1103 open Hardware Systems Engineering (AI ML Hardware) roles from 111 employers tracked in the SemiconductorJobs index, counted 5 Nov 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Software, Firmware & Systems family row. Figures refresh nightly.