Staff Electromechanical Packaging Engineer
Focus on chip scale packaging design and HDI organic substrate layout for integrated voltage regulator product lines.
About the role
Navitas Semiconductor is seeking a Staff Electromechanical Packaging Engineer to support packaging design and substrate layout for integrated voltage regulator products.
What you'll do
- Support chip scale packaging design and HDI organic substrate layout for integrated voltage regulator product lines.
- Collaborate with substrate layout, ASIC design, and manufacturing engineers.
- Create mechanical drawings for substrate fabrication and packaged part assembly.
- Work with vendors for components, assembly, and test.
- Work with OSAT (Out-Source Assembly and Test) suppliers to establish process baselines from prototype to mass production.
What you'll need
- Minimum BS in Mechanical or Electrical Engineering (MS or higher-level degree preferred).
- 3+ years of experience with microelectronics packaging, and/or PCB design.
- Understanding of how electrical design requirements impact substrate layout and interconnect selection.
- Proficiency with 3D mechanical CAD software (Creo, NX, Catia, etc.), generating mechanical drawings, and GD&T.
- Ability to read and create electrical schematics.
- Familiarity with tape out processes for wafers and substrates, as well as DFM principles.
Nice to have
- Knowledge of foundry processes and chip scale assembly processes.
- Familiarity with PCB design tools (Altium, Cadence, Mentor, etc.).
- Basic understanding of component level thermal analysis.
Skills: chip scale packaging, HDI substrate, mechanical CAD, Creo, OSAT, DFM
More semiconductor jobs: Packaging engineer jobs
This role has been open 7 days — well below the 33-day median for Packaging Engineering roles.
Packaging Engineering · Packaging
|
Open roles in category
279
|
Median days open
33 d
|
Category median salary (all employers)
$186k
|
See the full market breakdown ▾Category comparison, skills in demand, and who else is hiring
| Metric | Navitas Semiconductor | All employers we track in this specialty (279 roles · 46 employers) |
|---|---|---|
| Open roles in this specialty | 2 | 279 |
| Open roles in the wider Process, Fab & Equipment family | 7 | 10057 · 117 employers |
| Median days open | 5 d | 33 d (−28 d vs this employer) |
| Median salary (USD postings) | — | $186k |
Skills observed across this category: chip scale packaging, HDI substrate, mechanical CAD, Creo, OSAT, DFM
Who's hiring in this category
- Infineon Technologies · 36 open roles · median 21 d
- Renesas Electronics · 32 open roles · median 28 d
- Micron Technology · 18 open roles · median 50 d
- onsemi · 17 open roles · median 41 d
- STMicroelectronics · 16 open roles · median 17 d
- SanDisk · 14 open roles · median 9 d
How we counted: 279 open Packaging Engineering (Packaging) roles from 46 employers tracked in the SemiconductorJobs index, counted 8 Nov 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.