Semiconductor Packaging Modeling and Simulation Engineer - Waterloo, ON, Canada
Originally posted 21 September 2026 by the employer — open 1 day.
About the role
This role involves supporting new power module development and new product design through semiconductor packaging modeling and simulation. The position focuses on thermal-mech simulation for microelectronic packaging, assembly processes, and reliability issues.
What you'll do
- Perform thermal-mech simulation for microelectronic packaging and system, assembly process.
- Analyze existing package reliability issues induced by thermal problems.
- Analyze and correlate thermal mech modeling results to measured data.
- Develop and maintain thermal mech modeling methodology to improve efficiency and accuracy.
- Develop simulation methodology including Digital Twin, AI and machine learning algorithms, crystal plasticity models, Ag and Cu sintering models, and probability and optimization algorithms.
- Provide support to other thermal mech modeling users within the company.
What you'll need
- Master or PhD degree in Physics, Mechanical Engineering, Computational Mechanics, Solid Mechanics or Materials.
- Knowledge and experience in thermal modeling and mechanical modeling.
- Knowledge and experience in crystal plasticity and Cu/Ag sintering process.
- Knowledge and experience of CAD concepts and Solidworks.
- Familiarity with semiconductor packaging.
- Familiarity with material thermal mech properties.
- Strong knowledge of non-linear solid mechanics, fracture mechanics, and delamination.
- 2-3+ years of relevant experience.
- Familiarity with Unix/Linux operating system.
- Familiarity with FEA software ANSYS Mechanical APDL/Work Bench.
- Ability to perform model correlation to empirical measurement.
Nice to have
- PhD degree.
- Familiarity with package test and analysis, quality assurance, and reliability methods.
Skills: thermal modeling, mechanical modeling, FEA, semiconductor packaging, fracture mechanics
This role has been open 0 days — well below the 68-day median for Packaging Engineering roles.
Packaging Engineering · Packaging
|
Open roles in category
194
|
Median days open
68 d
|
Median salary
$166k
|
See the full market breakdown ▾Category comparison, skills in demand, and who else is hiring
| Metric | onsemi | All employers we track in this specialty (194 roles · 41 employers) |
|---|---|---|
| Open roles in this specialty | 8 | 194 |
| Open roles in the wider Process, Fab & Equipment family | 282 | 9370 · 108 employers |
| Median days open | 49 d | 68 d (−19 d vs this employer) |
| Median salary (USD postings) | — | $166k |
Skills observed across this category: thermal modeling, mechanical modeling, FEA, semiconductor packaging, fracture mechanics
Who's hiring in this category
- Infineon Technologies · 27 open roles · median 33 d
- Renesas Electronics · 20 open roles · median 25 d
- Micron Technology · 17 open roles · median 144 d
- Intel Corporation · 12 open roles · median 150 d
- Monolithic Power Systems · 12 open roles · median 186 d
- onsemi (this employer) · 7 open roles · median 66 d
How we counted: 194 open Packaging Engineering (Packaging) roles from 41 employers tracked in the SemiconductorJobs index, counted 22 Sept 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.