Packaging Engineer (AI/ML)
Originally posted 15 July 2026 by the employer.
About the role
As a Packaging Engineer (AI/ML) at SanDisk, you will integrate assembly/test data pipelines, analyze process data, and develop automation and AI solutions for manufacturing operations.
What you'll do
- Integrate assembly/test data pipelines to analyze and transform manufacturing process data.
- Develop new processes for NPI and support transfer to HVM without major quality issues.
- Develop and implement process improvement initiatives utilizing Six Sigma and Lean methodologies.
- Design and conduct experiments to troubleshoot manufacturing process issues and validate improvements.
- Develop and optimize Oracle SQL and Microsoft SQL Server queries for data access, reporting, and factory automation applications.
- Integrate factory systems and equipment via web services, API calls, or SECS/GEM communication protocols.
What you'll need
- Bachelor’s or Master’s degree in Mechatronic Engineering, Computer Engineering, Computer Science, Software Engineering, Electrical Engineering, Data Science, Artificial Intelligence, Machine Learning, or a related technical field.
- Minimum of 3 years of relevant working experience as a data scientist or in an engineering field.
- Proficiency in statistical data analysis using JMP software and knowledge of statistical techniques such as regression and distribution properties.
- Knowledge of machine learning techniques such as neural networks, along with programming experience in Python, R, and database querying using SQL.
- Experience or academic projects involving manufacturing automation, MES integration, or factory data systems.
Nice to have
- Experience as a Data Scientist with manufacturing/engineering knowledge.
Skills: assembly/test, NPI, SECS/GEM, process improvement, Six Sigma
More semiconductor jobs: SanDisk jobs · Packaging engineer jobs · Malaysia jobs
This role has been open 0 days — well below the 46-day median for Packaging Engineering roles.
Packaging Engineering · Packaging
|
Open roles in category
250
|
Median days open
46 d
|
Category median salary (all employers)
$166k
|
See the full market breakdown ▾Category comparison, skills in demand, and who else is hiring
| Metric | SanDisk | All employers we track in this specialty (250 roles · 45 employers) |
|---|---|---|
| Open roles in this specialty | 6 | 250 |
| Open roles in the wider Process, Fab & Equipment family | 73 | 10091 · 105 employers |
| Median days open | 0 d | 46 d (−46 d vs this employer) |
| Median salary (USD postings) | — | $166k |
Skills observed across this category: assembly/test, NPI, SECS/GEM, process improvement, Six Sigma
Who's hiring in this category
- Renesas Electronics · 31 open roles · median 39 d
- Infineon Technologies · 26 open roles · median 42 d
- Micron Technology · 20 open roles · median 79 d
- onsemi · 15 open roles · median 35 d
- Skyworks · 15 open roles · median 3 d
- Intel Corporation · 12 open roles · median 71 d
How we counted: 250 open Packaging Engineering (Packaging) roles from 45 employers tracked in the SemiconductorJobs index, counted 30 Oct 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.