Recent Graduate-Process Engineer – Advanced Semiconductor Packaging
$76,870 USD yearly
Originally posted 2 November 2026 by the employer.
About the role
This onsite Process Engineer role at the High Frequency Technology Center (HFTC) develops advanced packaging processes, process integration, and New Product Introduction for System in Package (SiP) modules integrated with microwave and mmWave subsystems. Work takes place in Keysight's microfabrication facility using proprietary indium phosphide (InP), gallium arsenide (GaAs), and silicon technologies.
What you'll do
- Define process flows, develop assembly processes, and drive continuous process improvement (CPI) to maximize yield for System in Package (SiP) modules.
- Drive process control and stability using statistical process control (SPC), root cause analysis, and tools such as JMP.
- Propose Design of Experiment (DOE) plans, execute experiments, and implement process changes in a controlled fashion.
- Champion capital equipment acquisition projects encompassing tool evaluation, characterization, process development, and qualification.
- Execute operations across packaging domains including die attach (flip chip and thermocompression bonding), surface mount technology (SMT), automatic adhesive dispense, pick and place, die singulation, and metrology (profilometry, SEM, XRF, optical microscopy).
- Review new designs for manufacturability and provide technical feedback to module designers and operations teams.
What you'll need
- M.S. or Ph.D. in Materials Science, Physics, Chemistry, Mechanical Engineering, Manufacturing Engineering, Mechatronics, or related fields (or B.S. with relevant experimental research experience).
- Graduation date in 2026 or degree completion by June 2027.
- Academic, cleanroom, or internship experience in microelectronics assembly, die attach, surface mount technology (SMT), or semiconductor fabrication processes.
- Hands-on experience in process development and data-driven process optimization.
- Ability to work inside a cleanroom handling hardware for several hours each day.
- U.S. Person status (U.S. citizen, permanent resident, or protected individual) as required for U.S. export control compliance.
Nice to have
- Industrial semiconductor, advanced packaging, or heterogeneous integration experience.
- Familiarity with programming and operating automatic assembly equipment.
- Experience with forming metallurgical bonds between similar metals, adhesives, underfill materials, and dispense processes.
- Experience with wafer singulation processes.
- Familiarity with thermal, mechanical, and electrical reliability or project lifecycles.
- Experience with III-V compound semiconductors (InP, GaAs) or silicon technologies.
More semiconductor jobs: Keysight Technologies jobs · Process engineer jobs
This role has been open 2 days — well below the 40-day median for Process Integration roles.
Process Integration · Advanced Packaging
|
Open roles in category
88
|
Median days open
40 d
|
Category median salary (all employers)
$195k
|
See the full market breakdown ▾Category comparison, and who else is hiring
| Metric | Keysight Technologies | All employers we track in this specialty (88 roles · 21 employers) |
|---|---|---|
| Open roles in this specialty | 1 | 88 |
| Open roles in the wider Process, Fab & Equipment family | 127 | 10085 · 116 employers |
| Median days open | 2 d | 40 d (−38 d vs this employer) |
| Median salary (USD postings) | — | $195k |
Who's hiring in this category
- Micron Technology · 21 open roles · median 40 d
- SkyWater Technology · 12 open roles · median 14 d
- Applied Materials · 10 open roles · median 48 d
- GlobalFoundries · 8 open roles · median 102 d
- Intel Corporation · 8 open roles · median 41 d
- Renesas Electronics · 6 open roles · median 46 d
How we counted: 88 open Process Integration (Advanced Packaging) roles from 21 employers tracked in the SemiconductorJobs index, counted 4 Nov 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.