π Internships and Entry Level jobs
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Principal Engineer- CPU Circuit Design - Bangalore, India
Intel Corporation
On-site
India, Bangalore, India
September 7, 2026
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Memory Core Design Engineering Intern - Rancho Cordova, United States
Solidigm
Full-time
On-site
Rancho Cordova, United States
September 7, 2026
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IC Validation Engineer Intern, MS - Summer 2027 - United States
Marvell Technology
Internship
On-site
3 Locations, United States
$33 - $66 USD yearly
September 5, 2026
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SRAM Circuit Design Engineer - MA, Boxborough, United States
AMD
Full-time
Remote friendly (US, MA, Boxborough, United States)
United States
September 4, 2026
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HPC DDR Controller Design Engineer / Leader - Kodaira, Japan
Renesas Electronics
Full-time
On-site
Kodaira, Japan
September 4, 2026
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Semiconductor Design Engineer - San Jose, CA, United States
Micron Technology
Full-time
On-site
San Jose, CA, United States
$173,607 - $246,000 USD yearly
September 4, 2026
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NVM Circuit Design Engineer, Staff
Synopsys
On-site
img src="https://tbcdn.talentbrew.com/company/44408/gst_v1/img/icon-map-black.png" height="15" width="15" alt="pin icon">Hsinchu, Taiwan
September 3, 2026
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Intern - Memory & System Architecture Research
Micron Technology
Full-time
On-site
2 Locations
$50 - $56 USD yearly
September 3, 2026
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Senior Staff Engineer Memory Macro Design and Architecture Verification (f/m/div) - Munich, Germany
Infineon Technologies
On-site
Munich, Germany
September 3, 2026
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Staff Design Engineer - Hillsboro, OR, United States
QORVO
On-site
Hillsboro, OR, US, 97124, United States
September 3, 2026
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Sr RF Characterization Engineer - San Jose, CA, United States
QORVO
On-site
San Jose, CA, US, 95134, United States
$115,600 - $150,500 USD yearly
September 3, 2026
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Staff Design Engineer - Hillsboro, OR, United States
QORVO
On-site
Hillsboro, OR, US, 97124, United States
September 3, 2026
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Sr Design Readiness Engineer - Boise, ID - Main Site, United States
Micron Technology
Full-time
On-site
Boise, ID - Main Site, United States
September 2, 2026
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Senior Staff Datapath Design Engineer and Circuit Design Engineer, VLSI Design Engineering - Milpitas, United States
SanDisk
Full-time
On-site
Milpitas, United States
September 2, 2026
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Staff VLSI Design Engineer, VLSI Design Engineering - Milpitas, United States
SanDisk
Full-time
On-site
Milpitas, United States
September 2, 2026
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NAND CORE Design Engineer - Milpitas, United States
SanDisk
Full-time
On-site
Milpitas, United States
September 2, 2026
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Staff VLSI Design Engineer - Milpitas, United States
SanDisk
Full-time
On-site
Milpitas, United States
September 2, 2026
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Mixed-signal Design Architect, HBM Architecture - United States
Micron Technology
On-site
2 Locations, United States
$146,000 - $297,000 USD yearly
September 2, 2026
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Intern - Advanced DRAM Cell & Device Technology - Boise, ID - Main Site, United States
Micron Technology
Full-time
Remote friendly (Boise, ID - Main Site, United States)
United States
September 2, 2026
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Design Engineering Intern (m/f/d) - Munich, DE, United States
QORVO
Internship
On-site
Munich, DE, 81829, United States
September 2, 2026
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Filter Design Intern (m/f/d) - Munich, DE, United States
QORVO
Internship
On-site
Munich, DE, 81829, United States
September 2, 2026
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Principal Mask Design Engineer - Seoul, South Korea
SanDisk
Full-time
On-site
Seoul, South Korea
September 1, 2026
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Sr. Memory Designer - San Jose, CA, United States
Lattice Semiconductor
On-site
San Jose, CA, United States
$248,400 USD yearly
September 1, 2026
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New College Grad - Mixed Signal Design Engineer, HBM - Richardson, TX, United States
Micron Technology
Full-time
On-site
Richardson, TX, United States
September 1, 2026
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Intern - DRAM Technology DTCO & PPA Assessment Engineer - Boise, ID - Main Site, United States
Micron Technology
Full-time
On-site
Boise, ID - Main Site, United States
September 1, 2026
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ιγγθ εγγγ¨γ³γΈγγ’ θ·οΌNANDθ¨θ¨θ·οΌ*Disability - Tokyo, Japan
Micron Technology
Full-time
On-site
Tokyo, Japan
September 1, 2026
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Director of Buffer & Memory Subsystem Architecture - San Jose, CA, United States
SK Hynix America
On-site
San Jose, CA, United States
$250,000 - $300,000 USD yearly
September 1, 2026
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Senior Memory Design Engineer, HBM - Richardson, TX, United States
Micron Technology
Full-time
On-site
Richardson, TX, United States
September 1, 2026
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Next-Gen, High-Speed HBM, LPDDR Memory Controller ASIC Digital Design Engineer
Qualcomm
On-site
San Diego, California, United States of America
September 1, 2026
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Layout Design Sr Engineer
Synopsys
On-site
img src="https://tbcdn.talentbrew.com/company/44408/gst_v1/img/icon-map-black.png" height="15" width="15" alt="pin icon">Ho Chi Minh City, Vietnam
August 31, 2026
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mm-Wave/RF System & Design Intern - Richardson, TX, United States
QORVO
Internship
On-site
Richardson, TX, US, 75081, United States
$31 - $42 USD yearly
August 31, 2026
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R&D Engineering, Sr Manager
Synopsys
On-site
img src="https://tbcdn.talentbrew.com/company/44408/gst_v1/img/icon-map-black.png" height="15" width="15" alt="pin icon">Noida, India
August 30, 2026
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RFIC Design Intern - Chelmsford, MA, United States
QORVO
Internship
On-site
Chelmsford, MA, US, 1824, United States
$31 - $42 USD yearly
August 30, 2026
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RF Design Engineering Intern - Richardson, TX, United States
QORVO
Internship
On-site
Richardson, TX, US, 75081, United States
$31 - $42 USD yearly
August 30, 2026
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RF Design Engineering Intern - Denver, CO, United States
QORVO
Internship
On-site
Denver, CO, US, 80014, United States
$31 - $42 USD yearly
August 30, 2026
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RF Design Engineer Intern - Richardson, TX, United States
QORVO
Internship
On-site
Richardson, TX, US, 75081, United States
$31 - $42 USD yearly
August 30, 2026
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RFIC Design Intern - Greensboro, NC, United States
QORVO
Internship
On-site
Greensboro, NC, US, 27409, United States
$31 - $42 USD yearly
August 30, 2026
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RFIC Design Engineer Intern - Chelmsford, MA, United States
QORVO
Internship
On-site
Chelmsford, MA, US, 1824, United States
$31 - $42 USD yearly
August 30, 2026
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RF Design Engineering Intern - Denver, CO, United States
QORVO
Internship
On-site
Denver, CO, US, 80014, United States
$31 - $42 USD yearly
August 30, 2026
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Senior Staff, Systems Design Engineering - Hsinchu, Taiwan
SanDisk
Full-time
Remote friendly (Hsinchu, Taiwan)
Taiwan
August 28, 2026
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RF Design Engineering Intern - Hillsboro, OR, United States
QORVO
Internship
On-site
Hillsboro, OR, US, 97124, United States
$31 - $42 USD yearly
August 28, 2026
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Design Engineering Intern - Apopka, FL, United States
QORVO
Internship
On-site
Apopka, FL, US, 32703, United States
$31 - $42 USD yearly
August 28, 2026
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Staff IC Layout Engineer - Reading, Berkshire, RG7 4SW, United Kingdom
QORVO
On-site
Reading, Berkshire, GB, RG7 4SW, United Kingdom
August 28, 2026
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Staff Design Engineer, HBM Architecture - Richardson, TX, United States
Micron Technology
Full-time
On-site
Richardson, TX, United States
$146,000 - $297,000 USD yearly
August 27, 2026
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Senior Design Engineer, HBM - Richardson, TX, United States
Micron Technology
Full-time
On-site
Richardson, TX, United States
August 26, 2026
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Member of Technical Staff , Memory Design - Hyderabad - Phoenix Aquila, India
Micron Technology
Full-time
On-site
Hyderabad - Phoenix Aquila, India
August 26, 2026
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IP Logic Design Engineer - Rancho Cordova, United States
Solidigm
Full-time
On-site
Rancho Cordova, United States
$105,440 - $164,800 USD yearly
August 26, 2026
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PA Design Engineering Intern - Chelmsford, MA, United States
QORVO
Internship
On-site
Chelmsford, MA, US, 1824, United States
$31 - $42 USD yearly
August 26, 2026
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R&D Engineering, Director
Synopsys
On-site
img src="https://tbcdn.talentbrew.com/company/44408/gst_v1/img/icon-map-black.png" height="15" width="15" alt="pin icon">Hyderabad, India
August 25, 2026
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Media Architecture and Integration Engineer (NAND/SSD) - Minhang District, China
Solidigm
Full-time
On-site
Minhang District, China
August 25, 2026