Mixed-signal Design Architect, HBM Architecture - United States
$146,000 - $297,000 USD yearly
Originally posted 2 September 2026 by the employer.
Focus on the architecture of 3D-stacked, high-performance memories.
About the role
This role involves designing, simulating, analyzing, and optimizing the architecture of 3D-stacked, high-performance memories. The position focuses on trade-offs in 3D-stacked logic and memory designs.
What you'll do
- Design, optimize, and simulate critical analog and/or mixed-signal circuits.
- Architect and design power delivery for high-performance, stacked memories.
- Analyze, specify, and prototype on-/off-chip interfaces.
- Perform timing, area, power, and complexity analysis for high-performance, low-power circuits.
- Define architectures for improved thermal management.
- Conduct pathfinding activities for future-generation stacked-memory products.
- Compose and maintain architecture documentation.
What you'll need
- Experience with analog and/or mixed-signal design, including simulation and floorplanning.
- Experience with transistor-level simulation (e.g., FineSim, HSPICE) including corner analysis.
- Ability to analyze architecture tradeoffs and use findings to develop specifications.
- Experience with power delivery analysis, tradeoffs, constraints, and challenges.
- 5+ years of proven experience delivering mixed-signal circuit designs, 3D-stacked memory or logic designs, or complex packaging architectures.
Nice to have
- Familiarity with DRAM or high-performance, 3D-stacked memory devices like HBM.
- Contributions to thermal and/or power delivery solutions for stacked architectures.
- Experience in one or more scripting languages (e.g., Python, Perl) and hardware description language (e.g., Verilog).
- A Masters or PhD in Computer Science, Computer Engineering, Electrical Engineering, or equivalent experience.
Skills: HBM, stacked memories, mixed-signal design, power delivery, architecture
This role has been open 32 days — well below the 69-day median for Memory Design roles.
Memory Design · Memory Design
|
Open roles in category
287
|
Median days open
69 d
|
Median salary
$205k
|
See the full market breakdown ▾Category comparison, skills in demand, and who else is hiring
| Metric | Micron Technology | All employers we track in this specialty (287 roles · 29 employers) |
|---|---|---|
| Open roles in this specialty | 153 | 287 |
| Median days open | 86 d | 69 d (+17 d vs this employer) |
| Median salary (USD postings) | — | $205k |
Skills observed across this category: HBM, stacked memories, mixed-signal design, power delivery, architecture
Who's hiring in this category
- Micron Technology (this employer) · 151 open roles · median 86 d
- Synopsys · 27 open roles · median 49 d
- SanDisk · 17 open roles · median 32 d
- Broadcom · 16 open roles · median 50 d
- Qualcomm · 12 open roles · median 149 d
- NVIDIA · 7 open roles · median 59 d
How we counted: 287 open Memory Design (Memory Design) roles from 29 employers tracked in the SemiconductorJobs index, counted 5 Oct 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there. Figures refresh nightly.