Staff Design Engineer, HBM Architecture - Richardson, TX, United States
$146,000 - $297,000 USD yearly
Originally posted 27 August 2026 by the employer.
Focus on HBM (High Bandwidth Memory) products.
About the role
What you'll do
- Architect and design HBM read and write datapath across core and logic die, including alignment, buffering, timing, and control logic.
- Develop high-speed, low-latency datapath circuits supporting multi-channel HBM architectures and wide internal buses.
- Optimize datapath designs for bandwidth, power, area, and timing closure at advanced technology nodes.
- Design and integrate data reliability features, including parity, ECC hooks, lane redundancy, and remapping mechanisms.
- Drive schematic-level and RTL-level datapath implementations, including clocking, gating, and reset strategies.
- Contribute to design reviews, documentation, and technical mentoring across HBM programs.
What you'll need
- Bachelor’s degree in Electrical Engineering, Computer Engineering, or a related field with 7+ years of relevant industry experience, or a Master’s degree with 5+ years of relevant industry experience.
- 3+ years of experience in high-speed digital datapath design (memory, SerDes, or SoC datapath).
- 3+ years of hands-on experience with digital schematic build, RTL, or mixed-signal datapath implementations.
Nice to have
- Strong understanding of HBM/DRAM architectures, including read/write data flow, timing, and multi-channel operation.
- Working knowledge of layout and floorplanning considerations for high-speed datapath.
- Experience with static timing analysis (STA) and timing-closure methodologies.
- Familiarity with advanced process-node challenges related to signal integrity, skew control, and power optimization.
Skills: HBM datapath, logic-die, core-die, high-speed digital datapath, RTL
This role has been open 39 days — well below the 69-day median for Memory Design roles.
Memory Design · Memory Design
|
Open roles in category
287
|
Median days open
69 d
|
Median salary
$205k
|
See the full market breakdown ▾Category comparison, skills in demand, and who else is hiring
| Metric | Micron Technology | All employers we track in this specialty (287 roles · 29 employers) |
|---|---|---|
| Open roles in this specialty | 153 | 287 |
| Median days open | 86 d | 69 d (+17 d vs this employer) |
| Median salary (USD postings) | — | $205k |
Skills observed across this category: HBM datapath, logic-die, core-die, high-speed digital datapath, RTL
Who's hiring in this category
- Micron Technology (this employer) · 151 open roles · median 86 d
- Synopsys · 27 open roles · median 49 d
- SanDisk · 17 open roles · median 32 d
- Broadcom · 16 open roles · median 50 d
- Qualcomm · 12 open roles · median 149 d
- NVIDIA · 7 open roles · median 59 d
How we counted: 287 open Memory Design (Memory Design) roles from 29 employers tracked in the SemiconductorJobs index, counted 5 Oct 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there. Figures refresh nightly.