📌 Software and IT jobs
-
SRAM Circuit Design Engineer - Beaverton, United States
Apple
On-site
Beaverton, United States
July 20, 2026
-
Design Engineer, DEG Design Method - Boise, ID - Main Site, United States
Micron Technology
Full-time
On-site
Boise, ID - Main Site, United States
July 20, 2026
-
Design engineer - Hyderabad - Phoenix Aquila, India
Micron Technology
Full-time
On-site
Hyderabad - Phoenix Aquila, India
July 20, 2026
-
Non-Volatile Memory (NVM) Architect - Brno, South Moravia, Czech Republic
onsemi
On-site
Brno, South Moravia, Czech Republic
July 20, 2026
-
Senior Principal – Non-Volatile Memory (NVM) - Brno, South Moravia, Czech Republic
onsemi
On-site
Brno, South Moravia, Czech Republic
July 20, 2026
-
Staff Memory Design Engineer - Hyderabad - Phoenix Aquila, India
Micron Technology
Full-time
On-site
Hyderabad - Phoenix Aquila, India
July 17, 2026
-
Memory Design Engineer - Singapore
Ambiq Micro
On-site
Singapore
July 17, 2026
-
3D Stacked DRAM Design Engineer - San Jose, CA, United States
SK Hynix America
On-site
San Jose, CA, United States
$150,000 - $260,000 USD yearly
July 16, 2026
-
3D Stacked Logic Design Engineer - San Jose, CA, United States
SK Hynix America
On-site
San Jose, CA, United States
$150,000 - $260,000 USD yearly
July 16, 2026
-
Principal Memory Design Engineer, HBM - Richardson, TX, United States
Micron Technology
Full-time
On-site
Richardson, TX, United States
July 16, 2026
-
HBM Staff Component Validation Engineer - Fab 10A, Singapore
Micron Technology
Full-time
On-site
Fab 10A, Singapore
July 16, 2026
-
System Architect for Advanced Memory System Architecture- DMTS/SMTS
Micron Technology
Full-time
On-site
2 Locations
July 15, 2026
-
Distinguished Engineer - Memory Architecture
NVIDIA
On-site
3 Locations
$320,000 - $488,750 USD yearly
July 15, 2026
-
MTS DRAM ASIC Architect - Bengaluru, India
Micron Technology
Full-time
On-site
Bengaluru, India
July 14, 2026
-
Design Engineer - DRAM Technology and Products - Boise, ID - Main Site, United States
Micron Technology
Full-time
On-site
Boise, ID - Main Site, United States
July 14, 2026
-
Senior / Staff SoC DRAM System Engineer - Hsinchu City, Taiwan
Qualcomm
On-site
Hsinchu City, Taiwan
July 14, 2026
-
Engineer, HIG HBM LAYOUT - Hyderabad - Phoenix Aquila, India
Micron Technology
Full-time
On-site
Hyderabad - Phoenix Aquila, India
July 13, 2026
-
New College Grad - Design Engineer, HBM - Richardson, TX, United States
Micron Technology
On-site
Richardson, TX, United States
July 13, 2026
-
Staff Analog Design Engineer - Boise, ID - Main Site, United States
Micron Technology
Full-time
On-site
Boise, ID - Main Site, United States
July 13, 2026
-
R&D Engineer IC Design - IND-Bangalore Electronic City - S1, India
Broadcom
Full-time
On-site
IND-Bangalore Electronic City - S1, India
July 12, 2026
-
Staff Design Engineer, DRAM - Boise, ID - Main Site, United States
Micron Technology
Full-time
On-site
Boise, ID - Main Site, United States
July 10, 2026
-
MTS, DEG Design Verification - Boise, ID - Main Site, United States
Micron Technology
Full-time
On-site
Boise, ID - Main Site, United States
July 10, 2026
-
Member of Technical Staff, SoC Power and Physical Architect, Next-generation HBM Architecture
Micron Technology
Full-time
On-site
Folsom, CA, United States
$191,000 - $334,000 USD yearly
July 10, 2026
-
Sr. RTL Design Engineer – DDR/LPDDR Memory Controller - TX, Austin, United States
AMD
Full-time
On-site
US, TX, Austin, United States
July 10, 2026
-
Senior Member of Technical Staff / Member of Technical Staff, DRAM Design Engineer, Next-generation HBM Architecture
Micron Technology
Full-time
On-site
Richardson, TX, United States
$100,000 - $200,000 USD yearly
July 9, 2026
-
Principal Layout Designer, Next-generation HBM Architecture - United States
Micron Technology
Full-time
On-site
2 Locations, United States
$62 - $122 USD yearly
July 9, 2026
-
Principal/MTS, Analog Design Engineering - Boise, ID - Main Site, United States
Micron Technology
Full-time
On-site
Boise, ID - Main Site, United States
July 9, 2026
-
Memory Circuit Design Engineer - Hyderabad - Phoenix Aquila, India
Micron Technology
Full-time
On-site
Hyderabad - Phoenix Aquila, India
July 9, 2026
-
New College Grad - Design Engineer, DRAM Technology and Products - Boise, ID - Main Site, United States
Micron Technology
Full-time
On-site
Boise, ID - Main Site, United States
July 9, 2026
-
Director - Memory Development - Bangalore, Karnataka, India
onsemi
On-site
Bangalore, Karnataka, India
July 9, 2026
-
Principal Design Engineer, DRAM - Boise, ID - Main Site, United States
Micron Technology
Full-time
On-site
Boise, ID - Main Site, United States
July 8, 2026
-
Senior Memory Designer - Penang, Malaysia
Lattice Semiconductor
On-site
Penang, Malaysia
July 8, 2026
-
Layout Design, Staff Engineer
Synopsys
On-site
img src="https://tbcdn.talentbrew.com/company/44408/gst_v1/img/icon-map-black.png" height="15" width="15" alt="pin icon">Ho Chi Minh City, Vietnam
July 8, 2026
-
Non-Volatile Memory Device/PI Engineer - Dallas, TX, United States
Texas Instruments
On-site
Dallas, TX, United States
July 8, 2026
-
DRAM Design Engineer - Boise, ID - Main Site, United States
Micron Technology
Full-time
On-site
Boise, ID - Main Site, United States
July 7, 2026
-
Layout Design, Sr Engineer in Etown Tan Binh
Synopsys
On-site
img src="https://tbcdn.talentbrew.com/company/44408/gst_v1/img/icon-map-black.png" height="15" width="15" alt="pin icon">Ho Chi Minh City, Vietnam
July 6, 2026
-
Senior Design Engineer - Memory Subsystem - Bengaluru, India
NVIDIA
On-site
India, Bengaluru, India
July 6, 2026
-
Senior Design Engineer/Architect, HBM - Richardson, TX, United States
Micron Technology
Full-time
On-site
Richardson, TX, United States
July 2, 2026
-
Sr. Custom Circuit Design Engineer (Memory, FPGA Fabric Designer) - Pune, India
Lattice Semiconductor
On-site
Pune, India
July 2, 2026
-
Memory Designer
Qualcomm
On-site
San Diego, California, United States of America, United States
$164,000 - $246,000 USD yearly
July 2, 2026
-
ENGINEER, NAND SILICON DESIGN VALIDATION - MSB, Singapore
Micron Technology
Full-time
On-site
MSB, Singapore
June 30, 2026
-
Senior Lead Engineer – Memory design - Bangalore, India
NXP Semiconductors
On-site
Bangalore, India
June 29, 2026
-
Embedded Memory Design Manager ---17876
Synopsys
On-site
img src="https://tbcdn.talentbrew.com/company/44408/gst_v1/img/icon-map-black.png" height="15" width="15" alt="pin icon">Da Nang, Vietnam
June 29, 2026
-
Senior Technologist Datapath Design Engineer and Circuit Design Engineer, VLSI Design Engineering
SanDisk
Full-time
On-site
Milpitas, United States
June 26, 2026
-
Director, Memory Integration Technology Roadmap - Santa Clara, CA, United States
Applied Materials
Remote friendly (Santa Clara, CA, United States)
United States
$172,000 - $237,000 USD yearly
June 25, 2026
-
Staff Digital Design Engineer, HBM - Richardson, TX, United States
Micron Technology
Full-time
On-site
Richardson, TX, United States
June 25, 2026
-
New College Grad - Memory Design Engineer, HBM - Richardson, TX, United States
Micron Technology
On-site
Richardson, TX, United States
June 24, 2026
-
New College Grad - Design Engineer, Circuit Design - San Jose, CA, United States
Micron Technology
Full-time
On-site
San Jose, CA, United States
$145,000 - $246,000 USD yearly
June 23, 2026
-
Director, HBM RTL Design and Integration
Micron Technology
Full-time
On-site
2 Locations
$177,000 - $348,000 USD yearly
June 23, 2026
-
Memory Circuit Design Engineer - United States
Intel Corporation
Full-time
Remote friendly (4 Locations, United States)
United States
$122,440 - $232,190 USD yearly
June 23, 2026