Principal Design Engineer, DRAM - Boise, ID - Main Site, United States
Originally posted 8 July 2026 by the employer.
Focus on developing, analyzing, and optimizing circuit designs for DRAM.
About the role
This role involves developing, analyzing, and optimizing circuit designs for Micron’s DRAM memory technologies. The Principal Design Engineer plays a key role in creating sophisticated digital and analog circuit innovations.
What you'll do
- Design and optimize memory circuits from gate-level to full chip implementations.
- Lead development of schematic blocks such as memory arrays, control logic, address decode, datapath, and internal test logic.
- Perform advanced circuit simulations using industry tools (e.g., SPICE, VERILOG) to validate performance.
- Drive architectural decisions related to power, speed, die area, and overall circuit performance.
- Collaborate with technology development and business units to define design rules, device requirements, and validation strategies.
What you'll need
- Bachelor’s degree in Electrical Engineering, Computer Engineering, or related technical field (or equivalent practical experience).
- Experience in semiconductor circuit design, layout, and optimization.
- Proficiency with circuit simulation and design tools such as SPICE and VERILOG.
- Demonstrated ability to interpret product requirements, logic diagrams, and device specifications.
- Experience evaluating and modifying semiconductor devices and components.
Nice to have
- Master’s degree or PhD in Electrical Engineering or a related discipline.
- Experience leading sophisticated circuit design projects or technical teams.
- Background in memory architecture, CMOS device behavior, and reliability considerations.
- Experience defining test chips and supporting silicon validation.
- Proven track record of innovation or using AI in circuit design or semiconductor technology.
Skills: memory circuits, gate-level design, full chip implementations, SPICE, VERILOG, memory architecture
This role has been open 200 days — well above the 69-day median for Memory Design roles.
Memory Design · Memory Design
|
Open roles in category
287
|
Median days open
69 d
|
Median salary
$205k
|
See the full market breakdown ▾Category comparison, skills in demand, and who else is hiring
| Metric | Micron Technology | All employers we track in this specialty (287 roles · 29 employers) |
|---|---|---|
| Open roles in this specialty | 153 | 287 |
| Median days open | 86 d | 69 d (+17 d vs this employer) |
| Median salary (USD postings) | — | $205k |
Skills observed across this category: memory circuits, gate-level design, full chip implementations, SPICE, VERILOG, memory architecture
Who's hiring in this category
- Micron Technology (this employer) · 151 open roles · median 86 d
- Synopsys · 27 open roles · median 49 d
- SanDisk · 17 open roles · median 32 d
- Broadcom · 16 open roles · median 50 d
- Qualcomm · 12 open roles · median 149 d
- NVIDIA · 7 open roles · median 59 d
How we counted: 287 open Memory Design (Memory Design) roles from 29 employers tracked in the SemiconductorJobs index, counted 5 Oct 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there. Figures refresh nightly.