Senior Design Engineer/Architect, HBM - Richardson, TX, United States
Originally posted 2 July 2026 by the employer.
About the role
This position focuses on architecting, designing, and optimizing high-speed datapath circuitry for JEDEC and custom HBM solutions.
What you'll do
- Architect, design, and optimize logic-die and core-die datapath circuitry for HBM products.
- Determine system specifications, input/output processes, and working parameters for hardware/software compatibility.
- Coordinate subsystem design and integration across multi-functional teams.
- Identify, analyze, and resolve system or program support deficiencies.
- Develop and recommend corrective actions to ensure robust datapath performance.
What you'll need
- Bachelor’s degree in Electrical Engineering, Computer Engineering, or a related field with 4 years of relevant industry experience or a Master’s degree in Electrical Engineering, Computer Engineering, or a related field with 2 years of relevant industry experience.
- Experience architecting, designing, or optimizing high-speed datapath circuitry.
- Ability to define and implement complex system requirements, identify issues, analyze root causes, and recommend corrective actions.
- Experience determining hardware/software system specifications and I/O processes.
- Experience coordinating subsystem design and system integration activities.
Nice to have
- PhD in Electrical Engineering, Computer Engineering, or related field.
- Experience working with JEDEC or custom HBM solutions.
- Experience collaborating with design, PHY, ECC, verification, layout, or system engineering teams.
Skills: HBM products, logic-die, core-die datapath, system requirements, subsystem integration, silicon bring-up
This role has been open 164 days — well above the 69-day median for Memory Design roles.
Memory Design · Memory Design
|
Open roles in category
287
|
Median days open
69 d
|
Median salary
$205k
|
See the full market breakdown ▾Category comparison, skills in demand, and who else is hiring
| Metric | Micron Technology | All employers we track in this specialty (287 roles · 29 employers) |
|---|---|---|
| Open roles in this specialty | 153 | 287 |
| Median days open | 86 d | 69 d (+17 d vs this employer) |
| Median salary (USD postings) | — | $205k |
Skills observed across this category: HBM products, logic-die, core-die datapath, system requirements, subsystem integration, silicon bring-up
Who's hiring in this category
- Micron Technology (this employer) · 151 open roles · median 86 d
- Synopsys · 27 open roles · median 49 d
- SanDisk · 17 open roles · median 32 d
- Broadcom · 16 open roles · median 50 d
- Qualcomm · 12 open roles · median 149 d
- NVIDIA · 7 open roles · median 59 d
How we counted: 287 open Memory Design (Memory Design) roles from 29 employers tracked in the SemiconductorJobs index, counted 5 Oct 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there. Figures refresh nightly.