New College Grad - Design Engineer, HBM - Richardson, TX, United States
Originally posted 13 July 2026 by the employer.
This role focuses on HBM architectures and advanced memory designs.
About the role
This role involves crafting and analyzing digital and analog circuits for memory products, contributing to advanced memory designs.
What you'll do
- Contribute to circuit design, layout, and optimization for memory and logic or analog circuits.
- Perform parasitic modeling and support design validation, including reticle experiments and tape-out revisions.
- Oversee and manage the layout process, including floor-planning, placement, and routing.
- Perform verification using modeling and simulation with industry-standard simulators.
- Collaborate across teams to drive standardization and shared design success.
- Partner with Marketing, Probe, Assembly, Test, Process Integration, and Product Engineering to support accurate manufacturability.
- Incorporate guidance from standards, computer-aided design (CAD), modeling, and verification teams to improve design quality.
What you'll need
- Bachelor’s or Master's degree in Electrical Engineering or a related field.
- Extensive knowledge of CMOS circuit design and semiconductor device physics.
- Experience with schematic entry, Verilog, FastSPICE, and HSPICE simulations.
- Strong understanding of timing, area, power, and complexity trade-offs in DRAM or mixed-signal design.
- Experience using AI-Enabled or AI Assisted tools to support simulation, modeling, data analysis, or engineering productivity improvements.
Nice to have
- Exposure to statistical or Monte Carlo simulation techniques and mixed-signal verification workflows.
- Experience with memory interfaces, HBM architectures, or mixed-signal IP integration through coursework or internships.
- Prior register-transfer level (RTL) design flow experience in DRAM or foundry processes.
Skills: memory products, CMOS circuit design, HBM architectures, DRAM, modeling and simulation
This role has been open 83 days — well above the 69-day median for Memory Design roles.
Memory Design · Memory Design
|
Open roles in category
287
|
Median days open
69 d
|
Median salary
$205k
|
See the full market breakdown ▾Category comparison, skills in demand, and who else is hiring
| Metric | Micron Technology | All employers we track in this specialty (287 roles · 29 employers) |
|---|---|---|
| Open roles in this specialty | 153 | 287 |
| Median days open | 86 d | 69 d (+17 d vs this employer) |
| Median salary (USD postings) | — | $205k |
Skills observed across this category: memory products, CMOS circuit design, HBM architectures, DRAM, modeling and simulation
Who's hiring in this category
- Micron Technology (this employer) · 151 open roles · median 86 d
- Synopsys · 27 open roles · median 49 d
- SanDisk · 17 open roles · median 32 d
- Broadcom · 16 open roles · median 50 d
- Qualcomm · 12 open roles · median 149 d
- NVIDIA · 7 open roles · median 59 d
How we counted: 287 open Memory Design (Memory Design) roles from 29 employers tracked in the SemiconductorJobs index, counted 5 Oct 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there. Figures refresh nightly.