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4,106 jobs listed
Showing 561–570 of 4106
Principal HBM Design Architect - Richardson, TX, United States
Micron Technology
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Full-time
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Richardson, TX, United States
June 8, 2026
Digital Design & SoC Architecture
Layout Design, Sr Engineer in HCMC
Synopsys
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img src="https://tbcdn.talentbrew.com/company/44408/gst_v1/img/icon-map-black.png" height="15" width="15" alt="pin icon">Ho Chi Minh City, Vietnam
June 7, 2026
Digital Design & SoC Architecture
Principal Memory PHY Architect (Power Modeling) - 16072
Synopsys
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img src="https://tbcdn.talentbrew.com/company/44408/gst_v1/img/icon-map-black.png" height="15" width="15" alt="pin icon">Sunnyvale, California, United States
June 7, 2026
Digital Design & SoC Architecture
New College Grad - HBM Layout Engineer - Jalisco, Mexico
Micron Technology
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Full-time
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Jalisco, Mexico
June 5, 2026
Digital Design & SoC Architecture
Staff Layout Designer - Hyderabad - Phoenix Aquila, India
Micron Technology
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Full-time
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Hyderabad - Phoenix Aquila, India
June 5, 2026
Digital Design & SoC Architecture
NAND Designer / Layout - Tokyo, Japan
Micron Technology
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Full-time
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Tokyo, Japan
June 4, 2026
Digital Design & SoC Architecture
Layout Design, Staff Engineer in Da Nang
Synopsys
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img src="https://tbcdn.talentbrew.com/company/44408/gst_v1/img/icon-map-black.png" height="15" width="15" alt="pin icon">Da Nang, Vietnam
June 4, 2026
Digital Design & SoC Architecture
CPU SRAM Design Engineer - Sr Staff / Principal - Austin, Texas, United States of America, United States
Qualcomm
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Remote friendly (Austin, Texas, United States of America, United States)
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$179,000 - $268,400 USD yearly
June 4, 2026
Digital Design & SoC Architecture
Optics Research Scientist / Technologist - Singapore
KLA Corporation
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Singapore
January 14, 2026
RF, Wireless & Photonics
Assistant Engineer - Krubong, MY, Malaysia
Vishay Intertechnology
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Krubong, MY, Malaysia
October 4, 2026
Packaging & Advanced Integration