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Micron Technology

Principal HBM Design Architect - Richardson, TX, United States

Micron Technology Richardson, TX, United States Full-time 4 months ago
Digital Design & SoC Architecture

Originally posted 8 June 2026 by the employer.

About the role

As a Principal HBM Design Architect, you will design, simulate, analyze, and floorplan digital and analog DRAM circuits used in advanced HBM technology, focusing on developing high-bandwidth DRAM solutions.

What you'll do

  • Design, simulate, and optimize digital and analog DRAM circuits including data path, ECC, command/control, and high-speed timing structures.
  • Evaluate full-chip and block-level functionality and propose solutions to achieve correct circuit and system behavior.
  • Perform timing, area, power, and complexity analysis for high-speed DRAM and mixed-signal circuits.
  • Conduct pathfinding studies and feasibility analyses for future HBM architectures.
  • Contribute to the development, layout, and optimization of memory, logic, and analog circuits.
  • Analyze circuit behavior under varying PVT and parasitic conditions to ensure robust operation.

What you'll need

  • BSEE with 7+ years, or MSEE with 5+ years of relevant circuit design experience.
  • Strong understanding of CMOS circuit design and device physics.
  • Experience with schematic entry and simulation using HSPICE, FineSim, or equivalent.
  • Experience with power distribution and network analysis.
  • Proficiency with scripting languages such as Python, Tcl, or Perl.

Nice to have

  • Familiarity with DRAM, memory subsystem design, or high-speed interface circuits.

Skills: DRAM circuits, data path, ECC, high-speed timing, CMOS circuit design, HBM architectures

Market context

This role has been open 152 days — well above the 69-day median for Memory Design roles.

Memory Design · Memory Design

Open roles in category
287
Median days open
69 d
Median salary
$205k
See the full market breakdown ▾Category comparison, skills in demand, and who else is hiring
How Micron Technology compares in Memory Design hiring
Metric Micron Technology All employers we track in this specialty (287 roles · 29 employers)
Open roles in this specialty 153 287
Median days open 86 d 69 d (+17 d vs this employer)
Median salary (USD postings) — $205k

Skills observed across this category: DRAM circuits, data path, ECC, high-speed timing, CMOS circuit design, HBM architectures

Who's hiring in this category

  • Micron Technology (this employer) · 151 open roles · median 86 d
  • Synopsys · 27 open roles · median 49 d
  • SanDisk · 17 open roles · median 32 d
  • Broadcom · 16 open roles · median 50 d
  • Qualcomm · 12 open roles · median 149 d
  • NVIDIA · 7 open roles · median 59 d

How we counted: 287 open Memory Design (Memory Design) roles from 29 employers tracked in the SemiconductorJobs index, counted 5 Oct 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there. Figures refresh nightly.

Apply now
Richardson, TX, United States
On-site
Full-time
4 months ago

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