Assistant Engineer - Krubong, MY, Malaysia
About the role
This role involves supporting the development and optimization of Die Bond and Wire Bond assembly processes.
What you'll do
- Support development and optimization of Die Bond and Wire Bond assembly processes for new product introductions (NPI).
- Plan and execute engineering builds, DOE (Design of Experiments), and process characterization activities.
- Collect, analyze, and interpret engineering data from process trials and qualifications.
- Generate technical reports, qualification summaries, and presentations.
- Support evaluation and qualification of new Die Bond and Wire Bond equipment.
What you'll need
- Diploma in Engineering (Semiconductor Technology, Microelectronics, Mechanical, Electrical, Electronic, Chemical Engineering, Science).
- Minimum of 2 years of relevant working experience.
- Basic understanding of semiconductor assembly and packaging processes.
- Knowledge of Die Bond and Wire Bond processes, SPC, DOE, and problem-solving methodologies.
- Proficient in Microsoft Office applications and data analysis tools.
Skills: Die Bond, Wire Bond, semiconductor assembly, packaging processes, SPC, DOE
This role has been open 3 days — well below the 61-day median for Packaging Engineering roles.
Packaging Engineering · Packaging
|
Open roles in category
195
|
Median days open
61 d
|
Median salary
$163k
|
See the full market breakdown ▾Category comparison, skills in demand, and who else is hiring
| Metric | Vishay Intertechnology | All employers we track in this specialty (195 roles · 44 employers) |
|---|---|---|
| Open roles in this specialty | 3 | 195 |
| Open roles in the wider Process, Fab & Equipment family | 159 | 9571 · 109 employers |
| Median days open | 40 d | 61 d (−21 d vs this employer) |
| Median salary (USD postings) | — | $163k |
Skills observed across this category: Die Bond, Wire Bond, semiconductor assembly, packaging processes, SPC, DOE
Who's hiring in this category
- Infineon Technologies · 26 open roles · median 45 d
- Renesas Electronics · 23 open roles · median 37 d
- Micron Technology · 17 open roles · median 151 d
- onsemi · 13 open roles · median 18 d
- Monolithic Power Systems · 11 open roles · median 198 d
- Intel Corporation · 8 open roles · median 173 d
How we counted: 195 open Packaging Engineering (Packaging) roles from 44 employers tracked in the SemiconductorJobs index, counted 4 Oct 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.