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10,357 jobs listed

Showing 8711–8720 of 10357

GlobalFoundries logo

Advanced Manufacturing Engineering Intern, Process & Equipment (Summer 2027) - USA - New York - Malta, United States

GlobalFoundries · Internship · USA - New York - Malta, United States · $20 - $40 USD hourly
September 25, 2026
Process & Device Engineering
Western Digital logo

Mechanical Simulation Engineer - San Jose, United States

Western Digital · Full-time · San Jose, United States
September 25, 2026
Digital Design & SoC Architecture
Broadcom logo

Agentic AI Architect - United States

Broadcom · Full-time · 2 Locations, United States · $129,400 - $207,000 USD yearly
September 25, 2026
AI/ML Hardware
Qualcomm logo

AI TLM Performance Modeling

Qualcomm · San Diego, California, United States of America, United States · $162,000 - $243,000 USD yearly
September 25, 2026
AI/ML Hardware
Infineon Technologies logo

Graduate - Quality Control Engineer - Leominster, MA, United States

Infineon Technologies · Leominster, MA, United States · $66,000 - $90,000 USD yearly
September 25, 2026
Product Engineering & Quality
Renesas Electronics logo

Senior Field Applications Engineer - Analog & Power - Farmington Hills, United States

Renesas Electronics · Full-time · Farmington Hills, United States
September 25, 2026
Applications & FAE
Ambarella logo

Business Development Director - US Headquarters, United States

Ambarella · Full-time · Remote friendly (US Headquarters, United States) · $184,000 - $260,000 USD yearly
September 25, 2026
Applications & FAE
Qualcomm logo

Sr. Staff Packaging Engineer- Process Package Integrity & Bumping - San Diego, California, United States of America

Qualcomm · San Diego, California, United States of America · $191,800 - $287,800 USD yearly
September 25, 2026
Process & Device Engineering
Intel Corporation logo

Advanced Packaging Module Development Engineer - Oregon, Hillsboro, United States

Intel Corporation · Hillsboro, Oregon, United States · $133,800 - $255,200 USD yearly
September 25, 2026
Process & Device Engineering
Intel Corporation logo

Senior Advanced Packaging Defect Inspection Engineer - Oregon, Hillsboro, United States

Intel Corporation · Hillsboro, Oregon, United States · $115,110 - $219,550 USD yearly
September 25, 2026
Process & Device Engineering
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