Advanced Packaging Module Development Engineer - Oregon, Hillsboro, United States
Process & Device Engineering
Originally posted 25 September 2026 by the employer.
About the role
This role drives technology development and enablement for high-volume manufacturing and future technology nodes within advanced packaging.
What you'll do
- Drive technology development for high-volume manufacturing and future technology nodes.
- Lead the design and development of technically sophisticated manufacturing processes, including material selection, parameter optimization, equipment metrology, and system design.
- Perform pathfinding activities in support of process and hardware development, enabling innovative device architectures.
- Recommend and implement modifications to operating equipment to improve production efficiency and optimize production output.
- Partner with key equipment and materials suppliers to develop and implement enabling elements of technology.
- Apply Statistical Process Control (SPC) and Design of Experiments (DOE) principles to drive data-informed decisions.
What you'll need
- Master's degree in Materials Science and Engineering, Mechanical Engineering, Chemical Engineering, Electrical Engineering, Physics, Chemistry, or a related field with 4+ years of relevant industry experience; or a PhD degree in the same fields with 3+ years of relevant experience.
- Technical expertise in semiconductor processing, system controls, opto-mechanics, or mechanical systems.
- Hands-on experience with robotics, automation systems, vision systems, or image processing.
Nice to have
- 4+ years of experience in Statistical Process Control (SPC) and Design of Experiments (DOE) principles.
- Programming experience in Python or MATLAB.
- Experience troubleshooting complex manufacturing processes and equipment.
- Experience in packaging processes, equipment automation development, or project management.
- Experience with semiconductor device physics and advanced packaging technologies.
Market context
This role has been open 1 day — well below the 57-day median for Process Integration roles.
Process Integration · Advanced Packaging
|
Open roles in category
74
|
Median days open
57 d
|
Median salary
$174k
|
See the full market breakdown ▾Category comparison, and who else is hiring
| Metric | Intel Corporation | All employers we track in this specialty (74 roles · 20 employers) |
|---|---|---|
| Open roles in this specialty | 12 | 74 |
| Open roles in the wider Process, Fab & Equipment family | 179 | 9460 · 108 employers |
| Median days open | 25 d | 57 d (−32 d vs this employer) |
| Median salary (USD postings) | — | $174k |
Who's hiring in this category
- Micron Technology · 13 open roles · median 110 d
- Intel Corporation (this employer) · 12 open roles · median 25 d
- GlobalFoundries · 10 open roles · median 96 d
- Applied Materials · 8 open roles · median 33 d
- Renesas Electronics · 7 open roles · median 12 d
- Lumilens · 4 open roles · median 51 d
How we counted: 74 open Process Integration (Advanced Packaging) roles from 20 employers tracked in the SemiconductorJobs index, counted 27 Sept 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.