Senior Advanced Packaging Defect Inspection Engineer - Oregon, Hillsboro, United States
Process & Device Engineering
Originally posted 25 September 2026 by the employer.
About the role
This role involves leading the definition, qualification, and deployment of advanced metrology and inspection equipment for complex packaging architectures.
What you'll do
- Drive technology development and enablement for high-volume manufacturing and future technology nodes.
- Lead the design and development of technically sophisticated metrology and inspection processes.
- Define and own the metrology group's long-range technology roadmap.
- Serve as the primary technical resource for fab support, providing engineering disposition on process excursions.
- Lead metrology module development across multiple concurrent advanced packaging programs.
What you'll need
- Bachelor's degree in materials science, electrical engineering, mechanical engineering, chemical engineering, physics, chemistry, or related STEM field with 4+ years of relevant experience; OR Master's degree in the same fields with 2+ years of relevant experience; OR PhD in the same fields.
- Expertise in semiconductor processing, wafer-level assembly, or cleanroom environments.
- Proficiency in process development methodologies, statistical process control, and manufacturing process improvement.
- Technical expertise in module engineering or fab process/hardware technology development.
Nice to have
- PhD and 3+ years of experience in relevant field.
- Metrology fundamental understanding and development experience.
- Experience with packaging processes, equipment automation development, or project management.
- Experience in Python, Dashboard Creation, and Scripting.
- Direct experience engaging with metrology equipment vendors at a technical roadmap level as a co-development partner.
Market context
This role has been open 1 day — well below the 57-day median for Process Integration roles.
Process Integration · Advanced Packaging
|
Open roles in category
74
|
Median days open
57 d
|
Median salary
$174k
|
See the full market breakdown ▾Category comparison, and who else is hiring
| Metric | Intel Corporation | All employers we track in this specialty (74 roles · 20 employers) |
|---|---|---|
| Open roles in this specialty | 12 | 74 |
| Open roles in the wider Process, Fab & Equipment family | 179 | 9460 · 108 employers |
| Median days open | 25 d | 57 d (−32 d vs this employer) |
| Median salary (USD postings) | — | $174k |
Who's hiring in this category
- Micron Technology · 13 open roles · median 110 d
- Intel Corporation (this employer) · 12 open roles · median 25 d
- GlobalFoundries · 10 open roles · median 96 d
- Applied Materials · 8 open roles · median 33 d
- Renesas Electronics · 7 open roles · median 12 d
- Lumilens · 4 open roles · median 51 d
How we counted: 74 open Process Integration (Advanced Packaging) roles from 20 employers tracked in the SemiconductorJobs index, counted 27 Sept 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.