Recent Openings
10,350 jobs listed
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Staff/Principal, APTD CEM - Advanced Packaging Wafer Level Technology Engineering - Fab 10A, Singapore
Micron Technology
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Full-time
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Fab 10A, Singapore
September 15, 2026
Packaging & Advanced Integration
Staff/Principal Engineer, Advanced Package Metrology-Real-Time Defect Analysis - Fab 10A, Singapore
Micron Technology
·
Full-time
·
Fab 10A, Singapore
September 15, 2026
Packaging & Advanced Integration
Staff/Principal Engineer, APTD CEM - Advanced Packaging Die Level Technology Engineering - Fab 10A, Singapore
Micron Technology
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Full-time
·
Fab 10A, Singapore
September 15, 2026
Packaging & Advanced Integration
MTB ASSEMBLY HBM PROCESS ENGINEER(FY28 NCG) - Taichung - MTB, Taiwan
Micron Technology
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Full-time
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Taichung - MTB, Taiwan
September 15, 2026
Packaging & Advanced Integration
半導体組立工程 技術開発エンジニア(1) - Yonezawa, Japan
Renesas Electronics
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Full-time
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Yonezawa, Japan
September 14, 2026
Packaging & Advanced Integration
Senior Engineer Unit Process Development Singulations - Melaka, Malaysia
Infineon Technologies
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Melaka, Malaysia
September 14, 2026
Packaging & Advanced Integration
Package Roadmap Tool Intern – Package Innovation - Kuala Lumpur, Malaysia
NXP Semiconductors
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Internship
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Kuala Lumpur, Malaysia
September 14, 2026
Packaging & Advanced Integration
Senior Solutions Architect - Deep Learning - Tel Aviv, Israel
NVIDIA
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Israel, Tel Aviv
September 14, 2026
AI/ML Hardware
Process Engineer - Bayan Lepas, my, Malaysia
Renesas Electronics
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Full-time
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Bayan Lepas, my, Malaysia
September 14, 2026
Packaging & Advanced Integration
Process Engineer - Bayan Lepas, my, Malaysia
Renesas Electronics
·
Full-time
·
Bayan Lepas, my, Malaysia
September 14, 2026
Packaging & Advanced Integration