MTB ASSEMBLY HBM PROCESS ENGINEER(FY28 NCG) - Taichung - MTB, Taiwan
Originally posted 15 September 2026 by the employer — open 4 days.
About the role
This role involves identifying, diagnosing, and resolving assembly process-related problems within MTB Assembly, specifically focusing on HBM (High Bandwidth Memory) process engineering.
What you'll do
- Identify, diagnose, and resolve assembly process related problems.
- Coordinate and execute process, equipment, and material evaluation/optimization initiatives.
- Lead/participate in continuous yield improvement and cost reduction activities.
- Validate and fan out new process baseline qualified for new product introduction.
- Support SPC/FDC/RMS/APC and site to site portability.
- Integrate AI-assisted tools and insights into daily work to improve efficiency, quality, or effectiveness.
What you'll need
- Ability to identify, diagnose and resolve assembly process related problems.
- Experience coordinating and executing process, equipment and material evaluation / optimization initiatives.
- Experience leading/participating in continuous yield improvement and cost reduction activities.
- Ability to validate and fan out new process baseline qualified.
- Knowledge of SPC/FDC/RMS/APC.
- Ability to apply baseline digital fluency and role‑appropriate AI literacy to use AI‑enabled tools responsibly and effectively.
Skills: MTB ASSEMBLY, HBM PROCESS ENGINEER, AI-assisted tools, continuous improvement, operational tasks
This role has been open 4 days — well below the 53-day median for Packaging Engineering roles.
Packaging Engineering · Advanced Packaging
|
Open roles in category
299
|
Median days open
53 d
|
Median salary
$179k
|
See the full market breakdown ▾Category comparison, skills in demand, and who else is hiring
| Metric | Micron Technology | All employers we track in this specialty (299 roles · 58 employers) |
|---|---|---|
| Open roles in this specialty | 36 | 299 |
| Open roles in the wider Process, Fab & Equipment family | 1454 | 9328 · 108 employers |
| Median days open | 28 d | 53 d (−25 d vs this employer) |
| Median salary (USD postings) | — | $179k |
Skills observed across this category: MTB ASSEMBLY, HBM PROCESS ENGINEER, AI-assisted tools, continuous improvement, operational tasks
Who's hiring in this category
- KLA Corporation · 49 open roles · median 100 d
- Micron Technology (this employer) · 36 open roles · median 27 d
- Renesas Electronics · 21 open roles · median 19 d
- Infineon Technologies · 18 open roles · median 39 d
- Intel Corporation · 13 open roles · median 74 d
- Lumilens · 13 open roles · median 43 d
How we counted: 299 open Packaging Engineering (Advanced Packaging) roles from 58 employers tracked in the SemiconductorJobs index, counted 19 Sept 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.