Package Roadmap Tool Intern – Package Innovation - Kuala Lumpur, Malaysia
Originally posted 14 September 2026 by the employer — open 5 days.
Join the team working on the Package Roadmap Tool.
About the role
This role involves developing and enhancing tools for structured definition, visualization, and management of package technology roadmaps across platforms.
What you'll do
- Design and implement a Package Roadmap Tool to track technology evolution, capabilities, and platform alignment.
- Support Platform Manager to integrate inputs from business lines, competitive analysis, and supplier data into a centralized roadmap framework.
- Improve data structure, usability, and automation of roadmap tracking, including dashboards and visualizations.
- Support Platform Manager for roadmap reviews and ensure alignment with PI strategy, cost targets, and technology readiness.
- Collaborate with platform, API, and manufacturing teams.
What you'll need
- Degree candidate in Computer Science, Engineering, or a related field.
- Strong programming and data structuring skills (e.g., Python, data tools, automation frameworks).
- Experience with Excel, Power BI, or similar tools for visualization and tool development.
- Ability to translate technical inputs into structured, scalable frameworks.
Nice to have
- Foundational knowledge of package assembly and process flows.
Skills: Package Roadmap Tool, technology evolution, platform alignment, package assembly, process flows
This role has been open 5 days — well below the 65-day median for Packaging Engineering roles.
Packaging Engineering · Packaging
|
Open roles in category
199
|
Median days open
65 d
|
Median salary
$166k
|
See the full market breakdown ▾Category comparison, skills in demand, and who else is hiring
| Metric | NXP Semiconductors | All employers we track in this specialty (199 roles · 41 employers) |
|---|---|---|
| Open roles in this specialty | 6 | 199 |
| Open roles in the wider Process, Fab & Equipment family | 120 | 9328 · 108 employers |
| Median days open | 17 d | 65 d (−48 d vs this employer) |
| Median salary (USD postings) | — | $166k |
Skills observed across this category: Package Roadmap Tool, technology evolution, platform alignment, package assembly, process flows
Who's hiring in this category
- Infineon Technologies · 28 open roles · median 30 d
- Micron Technology · 19 open roles · median 141 d
- Renesas Electronics · 19 open roles · median 23 d
- Intel Corporation · 12 open roles · median 147 d
- Monolithic Power Systems · 12 open roles · median 183 d
- onsemi · 7 open roles · median 63 d
How we counted: 199 open Packaging Engineering (Packaging) roles from 41 employers tracked in the SemiconductorJobs index, counted 19 Sept 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.