Staff/Principal Engineer, APTD CEM - Advanced Packaging Die Level Technology Engineering - Fab 10A, Singapore
Originally posted 15 September 2026 by the employer — open 4 days.
About the role
This role involves developing and enabling deployment of assembly processes for advanced packaging technologies to meet performance, cost, manufacturability, quality, reliability, and schedule requirements. It focuses on package development for high bandwidth memory (HBM) products and transfer to manufacturing.
What you'll do
- Develop and optimize assembly processes for advanced packaging technologies, including wafer-level packaging, Chip on Wafer, and Chip to Wafer die stacking.
- Evaluate and promote new equipment and materials to enhance process capabilities and set up process parameters.
- Ensure defense coverage through process, measurement, inspection, and testing.
- Conduct continuous data analysis to establish advanced controls and identify improvement opportunities.
- Coordinate the development and launch of new technologies and integration flows with internal and external stakeholders.
- Provide Process Of Record (POR) and Model Of Record (MOR) documentation for product transfer to production High Volume Manufacturing Fabrication facilities.
What you'll need
- PhD with ≥2 years, Master’s degree with ≥5 years, or Bachelor’s degree with ≥7 years of relevant experience in Electrical Engineering, Materials Science, Chemical Engineering, or Physics.
- Semiconductor process development or equipment evaluation experience in wafer bonding, die stacking, and packaging.
- Proficiency in Python, R, SQL for statistical analysis, process modeling, and data analytics.
- Experience with Visual Basic for automation and tool integration.
- Familiarity with E3, FDC (Fault Detection and Classification), and RMS (Recipe Management System) for equipment and process control.
- Strong data analytics capabilities to support SPC, DOE, defect analysis, and dashboarding.
- Strong understanding of process flows, process interactions, and how process changes can affect yield, performance, and reliability.
This role has been open 4 days — well below the 53-day median for Packaging Engineering roles.
Packaging Engineering · Advanced Packaging
|
Open roles in category
299
|
Median days open
53 d
|
Median salary
$179k
|
See the full market breakdown ▾Category comparison, and who else is hiring
| Metric | Micron Technology | All employers we track in this specialty (299 roles · 58 employers) |
|---|---|---|
| Open roles in this specialty | 36 | 299 |
| Open roles in the wider Process, Fab & Equipment family | 1454 | 9328 · 108 employers |
| Median days open | 28 d | 53 d (−25 d vs this employer) |
| Median salary (USD postings) | — | $179k |
Who's hiring in this category
- KLA Corporation · 49 open roles · median 100 d
- Micron Technology (this employer) · 36 open roles · median 27 d
- Renesas Electronics · 21 open roles · median 19 d
- Infineon Technologies · 18 open roles · median 39 d
- Intel Corporation · 13 open roles · median 74 d
- Lumilens · 13 open roles · median 43 d
How we counted: 299 open Packaging Engineering (Advanced Packaging) roles from 58 employers tracked in the SemiconductorJobs index, counted 19 Sept 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.