Senior Engineer Unit Process Development Singulations - Melaka, Malaysia
Originally posted 14 September 2026 by the employer — open 5 days.
About the role
This role involves process development activities for package singulation technologies, including tape-based, tapeless, laser, and hybrid singulation approaches.
What you'll do
- Perform process development activities, including parameter scouting, optimization, verification, and process freeze.
- Drive qualification and implementation of tape-based, tapeless, laser, and hybrid singulation solutions.
- Support technical handover and knowledge transfer to Operations.
- Generate and maintain documentation such as Process Specification, PFMEA, DFMEA, Master FMEA, OJTI, T32, and PDR.
- Evaluate emerging singulation technologies and establish technology readiness for industrial deployment.
- Liaise with suppliers to drive continuous improvement and perform verification and qualification for new tooling, machines, and materials.
What you'll need
- Minimum 10 years of experience in semiconductor backend assembly and package development.
- Minimum 5 years of direct experience in package singulation process development.
- Proven hands-on expertise in tape-based singulation, tapeless singulation, and laser singulation.
- Experience supporting high-volume semiconductor manufacturing environments.
- Demonstrated track record in process development, industrialization, and yield improvement.
- Experience with blade dicing, saw singulation, UV and IR laser singulation processes, stealth and advanced laser dicing technologies, multi-package, and panel-level singulation strategies.
Skills: package singulation, process development, laser singulation, blade dicing, assembly
This role has been open 5 days — well below the 65-day median for Packaging Engineering roles.
Packaging Engineering · Packaging
|
Open roles in category
199
|
Median days open
65 d
|
Median salary
$166k
|
See the full market breakdown ▾Category comparison, skills in demand, and who else is hiring
| Metric | Infineon Technologies | All employers we track in this specialty (199 roles · 41 employers) |
|---|---|---|
| Open roles in this specialty | 27 | 199 |
| Open roles in the wider Process, Fab & Equipment family | 315 | 9328 · 108 employers |
| Median days open | 30 d | 65 d (−35 d vs this employer) |
| Median salary (USD postings) | — | $166k |
Skills observed across this category: package singulation, process development, laser singulation, blade dicing, assembly
Who's hiring in this category
- Infineon Technologies (this employer) · 28 open roles · median 30 d
- Micron Technology · 19 open roles · median 141 d
- Renesas Electronics · 19 open roles · median 23 d
- Intel Corporation · 12 open roles · median 147 d
- Monolithic Power Systems · 12 open roles · median 183 d
- onsemi · 7 open roles · median 63 d
How we counted: 199 open Packaging Engineering (Packaging) roles from 41 employers tracked in the SemiconductorJobs index, counted 19 Sept 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.