Staff/Principal Engineer, Advanced Package Metrology-Real-Time Defect Analysis - Fab 10A, Singapore
Originally posted 15 September 2026 by the employer — open 4 days.
This role focuses on Advanced Package Metrology-RDA to enable advanced packaging technologies, including High Bandwidth Memory (HBM).
About the role
This role involves developing and enabling innovative inspection and metrology techniques to support advanced packaging technologies and identifying, diagnosing, and proposing yield related breakthroughs. The work includes delivering package development for high performance memory products, such as High Bandwidth Memory (HBM), and transferring them to manufacturing.
What you'll do
- Develop and optimize metrology recipes for semiconductor processes.
- Establish inspection methodologies and best known methods (BKM) for metrology processes.
- Utilize data analysis tools like Power BI to summarize and report on metrology recipe status and project progress.
- Own and manage metrology tools, ensuring they meet performance indicators and quality standards.
- Drive defense line readiness and set up control plans, OCAP (Out of Control Action Plans), and SPC (Statistical Process Control) charts.
- Engage in early involvement with Advanced Packaging Technology Development (APTD) to ensure seamless integration of new technologies.
What you'll need
- PhD with ≥2 years, Master’s degree with ≥5 years, or Bachelor’s degree with ≥7 years of relevant experience in Electrical Engineering, Materials Science, Chemical Engineering, or Physics.
- Semiconductor process or equipment engineering experience in wafer bonding, plating, warpage control, and packaging field.
- Proficiency in Python, R, SQL for statistical analysis, process modeling, and data analytics.
- Experience with Visual Basic for automation and tool integration.
- Familiarity with E3, FDC (Fault Detection and Classification), and RMS (Recipe Management System) for equipment and process control.
- Strong data analytics capabilities to support SPC, DOE, defect analysis, and dashboarding.
- Hands on experience with wafer/assembly tools or metrology/RDA systems.
Skills: advanced packaging, metrology techniques, inspection, recipe development, data analysis, SPC
This role has been open 4 days — well below the 53-day median for Packaging Engineering roles.
Packaging Engineering · Advanced Packaging
|
Open roles in category
299
|
Median days open
53 d
|
Median salary
$179k
|
See the full market breakdown ▾Category comparison, skills in demand, and who else is hiring
| Metric | Micron Technology | All employers we track in this specialty (299 roles · 58 employers) |
|---|---|---|
| Open roles in this specialty | 36 | 299 |
| Open roles in the wider Process, Fab & Equipment family | 1454 | 9328 · 108 employers |
| Median days open | 28 d | 53 d (−25 d vs this employer) |
| Median salary (USD postings) | — | $179k |
Skills observed across this category: advanced packaging, metrology techniques, inspection, recipe development, data analysis, SPC
Who's hiring in this category
- KLA Corporation · 49 open roles · median 100 d
- Micron Technology (this employer) · 36 open roles · median 27 d
- Renesas Electronics · 21 open roles · median 19 d
- Infineon Technologies · 18 open roles · median 39 d
- Intel Corporation · 13 open roles · median 74 d
- Lumilens · 13 open roles · median 43 d
How we counted: 299 open Packaging Engineering (Advanced Packaging) roles from 58 employers tracked in the SemiconductorJobs index, counted 19 Sept 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.