Assembler
About the role
MACOM is seeking an Assembler to support the build of electronic components and hybrid assemblies in a clean room environment supporting engineering and production. The role involves assembly processes including epoxy die attach, eutectic solder attach, wire bonding, gap welding, pull testing, and rework.
What you'll do
- Operate and set up manual, semiautomatic, and automated equipment for component epoxy attach, wire bonding, and other microelectronics assembly processes.
- Work with hybrid technology including MMICs, capacitors, inductors, substrates, and other micro components.
- Read and build to prototype and released assembly drawings and process documents, recommending changes to improve build processes.
- Work closely with engineering teams on new product development.
- Perform inventory operations including kitting, traceability, and material review.
What you'll need
- 5 years of related microelectronics assembly experience, with significant work utilizing a microscope.
- Hands-on experience with assembly processes including epoxy die attach, eutectic solder attach, wire bonding, gap welding, pull testing, and rework.
- Ability to read and interpret prototype and released assembly drawings and process documents.
- Ability to perform inventory operations such as kitting, material review, and traceability.
Nice to have
- Experience working with automated equipment.
- Experience in an engineering environment where all mentioned assembly processes were utilized.
Skills: die attach, wire bonding, hybrid assemblies, clean room
More semiconductor jobs: Packaging engineer jobs · San Diego jobs
This role has been open 0 days — well below the 48-day median for Packaging Engineering roles.
Packaging Engineering · Packaging
|
Open roles in category
242
|
Median days open
48 d
|
Category median salary (all employers)
$166k
|
See the full market breakdown ▾Category comparison, skills in demand, and who else is hiring
| Metric | MACOM | All employers we track in this specialty (242 roles · 44 employers) |
|---|---|---|
| Open roles in this specialty | 10 | 242 |
| Open roles in the wider Process, Fab & Equipment family | 96 | 10340 · 107 employers |
| Median days open | 1 d | 48 d (−47 d vs this employer) |
| Median salary (USD postings) | — | $166k |
Skills observed across this category: die attach, wire bonding, hybrid assemblies, clean room
Who's hiring in this category
- Renesas Electronics · 30 open roles · median 41 d
- Infineon Technologies · 26 open roles · median 41 d
- Micron Technology · 20 open roles · median 78 d
- onsemi · 16 open roles · median 34 d
- Skyworks · 15 open roles · median 2 d
- Intel Corporation · 11 open roles · median 113 d
How we counted: 242 open Packaging Engineering (Packaging) roles from 44 employers tracked in the SemiconductorJobs index, counted 29 Oct 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.