Senior Assember
About the role
MACOM is seeking a Senior Assembler to support the build of electronic components and hybrid assemblies in the San Diego facility. This position performs assembly processes in a clean room environment supporting both engineering and production.
What you'll do
- Operate and set up manual and semiautomatic equipment for epoxy die attach, eutectic solder attach, wire bonding, gap welding, pull testing, and rework.
- Run automated equipment for component epoxy attach and wire bonding.
- Work with hybrid technology including MMICs, capacitors, inductors, substrates, and other micro components.
- Read and execute prototype and released assembly drawings and process documents, recommending process improvements.
- Support new product development alongside engineering teams.
- Perform inventory operations including kitting, traceability, and material review, and train personnel on assembly processes.
What you'll need
- High school diploma or equivalent.
- Hands-on experience operating die bonding, wire bonding, scanning acoustic microscope, and device sealing equipment.
- Experience using microscopes to inspect products against quality standards.
- Demonstrated cleanroom assembly experience and ability to follow travelers, work instructions, and assembly drawings.
- Experience with MS Office programs and manufacturing execution systems for lot tracking.
- U.S. Person status due to ITAR regulations.
Nice to have
- Experience working with automated equipment.
Skills: die bonding, wire bonding, scanning acoustic microscope, hybrid assemblies
More semiconductor jobs: Packaging engineer jobs · San Diego jobs
This role has been open 0 days — well below the 48-day median for Packaging Engineering roles.
Packaging Engineering · Packaging
|
Open roles in category
242
|
Median days open
48 d
|
Category median salary (all employers)
$166k
|
See the full market breakdown ▾Category comparison, skills in demand, and who else is hiring
| Metric | MACOM | All employers we track in this specialty (242 roles · 44 employers) |
|---|---|---|
| Open roles in this specialty | 10 | 242 |
| Open roles in the wider Process, Fab & Equipment family | 96 | 10340 · 107 employers |
| Median days open | 1 d | 48 d (−47 d vs this employer) |
| Median salary (USD postings) | — | $166k |
Skills observed across this category: die bonding, wire bonding, scanning acoustic microscope, hybrid assemblies
Who's hiring in this category
- Renesas Electronics · 30 open roles · median 41 d
- Infineon Technologies · 26 open roles · median 41 d
- Micron Technology · 20 open roles · median 78 d
- onsemi · 16 open roles · median 34 d
- Skyworks · 15 open roles · median 2 d
- Intel Corporation · 11 open roles · median 113 d
How we counted: 242 open Packaging Engineering (Packaging) roles from 44 employers tracked in the SemiconductorJobs index, counted 29 Oct 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.