Substrates Materials Engineering Intern
Originally posted 2 November 2026 by the employer.
About the role
Supports engineers in defining material inspection methodologies, conducting studies for cost and process control, and running lab experiments to characterize new substrate materials.
What you'll do
- Support engineers to define material inspection methodology and conduct studies on cost control, process control, and production yield.
- Establish supplier process window validation activities on critical process modules for technology development.
- Perform basic root cause analysis to identify opportunities for process, quality, and reliability improvements.
- Conduct lab experiments to characterize new materials, analyze multiple candidate properties, and recommend the best candidates.
- Support engineering in benchmarking emerging technology, highlighting gaps across roadmap strategy, manufacturing capability, and market demand.
- Perform data analysis for problem-solving and process development.
What you'll need
- Currently pursuing a BS, MS, or PhD in Chemical, Material, Polymer, or Material Engineering fields, or in Chemistry, Physics, or Material Science.
- Fluent communication, articulation, and presentation skills in English.
- Working knowledge of data analytics and statistics.
Skills: substrates, material characterization, process control, yield, materials science
More semiconductor jobs: Intel Corporation jobs · Packaging engineer jobs · Malaysia jobs
This role has been open 0 days — well below the 41-day median for Packaging Engineering roles.
Packaging Engineering · Packaging
|
Open roles in category
258
|
Median days open
41 d
|
Category median salary (all employers)
$176k
|
See the full market breakdown ▾Category comparison, skills in demand, and who else is hiring
| Metric | Intel Corporation | All employers we track in this specialty (258 roles · 46 employers) |
|---|---|---|
| Open roles in this specialty | 13 | 258 |
| Open roles in the wider Process, Fab & Equipment family | 205 | 10118 · 104 employers |
| Median days open | 31 d | 41 d (−10 d vs this employer) |
| Median salary (USD postings) | — | $176k |
Skills observed across this category: substrates, material characterization, process control, yield, materials science
Who's hiring in this category
- Renesas Electronics · 33 open roles · median 39 d
- Infineon Technologies · 26 open roles · median 45 d
- Micron Technology · 18 open roles · median 82 d
- onsemi · 15 open roles · median 38 d
- Skyworks · 14 open roles · median 8 d
- SanDisk · 13 open roles · median 3 d
How we counted: 258 open Packaging Engineering (Packaging) roles from 46 employers tracked in the SemiconductorJobs index, counted 2 Nov 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.