Test & Plating Process Engineer (MES Project) - Wilayah Persekutuan Kuala Lumpur, Malaysia
Originally posted 7 October 2026 by the employer.
About the role
This role is focused on leading the digital design of Test & Plating manufacturing processes, involving a critical MES implementation project followed by a production role utilizing digital process controls.
What you'll do
- Drive manufacturing process design within the MES, defining process flows, routing, material handling, and traceability.
- Design digital logic for process controls and exception handling, including automated holds, rework loops, and material disposition.
- Align requirements between manufacturing and quality teams, validating digital workflows and supporting UAT and deployment.
- Manage process stability in a production role, using MES data for yield enhancement.
- Optimize process parameters, such as wedge bonding, through the new digital framework.
What you'll need
- Bachelor's degree in Chemical Engineering, Chemistry, Electrical Engineering, Materials Science Engineering, Mechanical Engineering, Physics, or a related field.
- Minimum 2 years of hands-on semiconductor process experience in Test & Plating.
- Strong foundation in statistical process control.
- Strong foundation in engineering change control.
- Strong foundation in process release strategies.
Nice to have
- Experience working with MES platforms (e.g., Siemens OpCenter) or comparable MES product modeling or configuration.
- Working awareness of PAC-related integration and adjacent automation flows.
- Experience in optimizing process parameters for wedge bonding or die attach accuracy.
Skills: MES implementation, Test & Plating, process control, yield enhancement, wedge bonding optimization
This role has been open 0 days — well below the 61-day median for Packaging Engineering roles.
Packaging Engineering · Advanced Packaging
|
Open roles in category
312
|
Median days open
61 d
|
Median salary
$165k
|
See the full market breakdown ▾Category comparison, skills in demand, and who else is hiring
| Metric | Texas Instruments | All employers we track in this specialty (312 roles · 60 employers) |
|---|---|---|
| Open roles in this specialty | 7 | 312 |
| Open roles in the wider Process, Fab & Equipment family | 240 | 9675 · 109 employers |
| Median days open | 19 d | 61 d (−42 d vs this employer) |
| Median salary (USD postings) | — | $165k |
Skills observed across this category: MES implementation, Test & Plating, process control, yield enhancement, wedge bonding optimization
Who's hiring in this category
- KLA Corporation · 52 open roles · median 118 d
- Micron Technology · 37 open roles · median 37 d
- Renesas Electronics · 21 open roles · median 37 d
- Infineon Technologies · 17 open roles · median 55 d
- Intel Corporation · 14 open roles · median 53 d
- onsemi · 14 open roles · median 28 d
How we counted: 312 open Packaging Engineering (Advanced Packaging) roles from 60 employers tracked in the SemiconductorJobs index, counted 7 Oct 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.