Turret, Tape & Reel Process Engineer (MES Project) - Wilayah Persekutuan Kuala Lumpur, Malaysia
Originally posted 7 October 2026 by the employer.
About the role
This role involves leading the digital design of Turret, Tape & Reel manufacturing processes, focusing on MES implementation and later transitioning to a production role to drive yield and efficiency using digital process controls.
What you'll do
- Represent Turret, Tape & Reel equipment engineering in the MES rollout.
- Define workflows, setup/recipe controls, and equipment states for MES.
- Translate Turret, Tape & Reel hardware requirements into digital designs and define data collection needs.
- Validate integration scenarios and support User Acceptance Testing (UAT) and deployment.
- Manage equipment uptime and leverage MES automation to improve packaging efficiency.
What you'll need
- Bachelor's degree in Chemical Engineering, Chemistry, Electrical Engineering, Materials Science Engineering, Mechanical Engineering, Physics, or a related field.
- Minimum 2 years of semiconductor process experience in Turret, Tape & Reel.
- Strong foundation in statistical process control.
- Strong foundation in engineering change control.
- Strong foundation in process release strategies.
Nice to have
- Experience working with MES platforms, such as Siemens OpCenter or a comparable MES product.
- Working awareness of PAC-related integration and adjacent automation flows.
- Experience in optimizing process parameters.
Skills: MES implementation, Turret, Tape & Reel, equipment engineering, process control, packaging efficiency
This role has been open 20 days — well below the 63-day median for Packaging Engineering roles.
Packaging Engineering · Advanced Packaging
|
Open roles in category
295
|
Median days open
63 d
|
Median salary
$167k
|
See the full market breakdown ▾Category comparison, skills in demand, and who else is hiring
| Metric | Texas Instruments | All employers we track in this specialty (295 roles · 59 employers) |
|---|---|---|
| Open roles in this specialty | 10 | 295 |
| Open roles in the wider Process, Fab & Equipment family | 253 | 10125 · 107 employers |
| Median days open | 25 d | 63 d (−38 d vs this employer) |
| Median salary (USD postings) | — | $167k |
Skills observed across this category: MES implementation, Turret, Tape & Reel, equipment engineering, process control, packaging efficiency
Who's hiring in this category
- KLA Corporation · 42 open roles · median 138 d
- Micron Technology · 39 open roles · median 45 d
- Intel Corporation · 20 open roles · median 30 d
- Renesas Electronics · 19 open roles · median 43 d
- GlobalFoundries · 14 open roles · median 70 d
- Lumilens · 13 open roles · median 81 d
How we counted: 295 open Packaging Engineering (Advanced Packaging) roles from 59 employers tracked in the SemiconductorJobs index, counted 27 Oct 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.