$24 - $43 USD hourly
About the role
Hands-on role supporting prototype and engineering builds in a semiconductor assembly environment. Focuses on equipment setup, troubleshooting, process execution, and problem solving to meet quick-turn customer and development needs.
What you'll do
- Run and support engineering builds, DOE trials, and prototype assembly lots
- Program and operate assembly equipment such as mold, grind, saw, laser, and coat tools
- Troubleshoot equipment and process issues and drive them to resolution
- Perform preventative maintenance (PMs), changeovers, and basic maintenance to keep tools production-ready
- Collect data and support root cause analysis and yield improvement efforts
- Document issues, updates, and changes through logs, work instructions, and pass-downs
What you'll need
- Associate degree in a technical field or equivalent military experience
- ~3–7 years of experience in semiconductor manufacturing or a similar high-tech environment
- Hands-on aptitude working directly on tools and solving issues in real time
- Strong mechanical and electrical aptitude
- Ability to work in a cleanroom environment requiring ESD and PPE, including shift work or extended hours when required
Nice to have
- Experience with semiconductor assembly processes including die attach, wire bond, molding, singulation, wafer thin/saw, and die pick
- Experience in prototype, NPI, or high-mix, low-volume manufacturing
- Basic understanding of SPC, DOE, and yield analysis
Skills: assembly equipment, wire bond, die attach, DOE, singulation
More semiconductor jobs: Packaging engineer jobs
This role has been open 10 days — well below the 33-day median for Packaging Engineering roles.
Packaging Engineering · Packaging
|
Open roles in category
279
|
Median days open
33 d
|
Category median salary (all employers)
$186k
|
See the full market breakdown ▾Category comparison, skills in demand, and who else is hiring
| Metric | Skyworks | All employers we track in this specialty (279 roles · 46 employers) |
|---|---|---|
| Open roles in this specialty | 11 | 279 |
| Open roles in the wider Process, Fab & Equipment family | 153 | 10057 · 117 employers |
| Median days open | 12 d | 33 d (−21 d vs this employer) |
| Median salary (USD postings) | — | $186k |
Skills observed across this category: assembly equipment, wire bond, die attach, DOE, singulation
Who's hiring in this category
- Infineon Technologies · 36 open roles · median 21 d
- Renesas Electronics · 32 open roles · median 28 d
- Micron Technology · 18 open roles · median 50 d
- onsemi · 17 open roles · median 41 d
- STMicroelectronics · 16 open roles · median 17 d
- SanDisk · 14 open roles · median 9 d
How we counted: 279 open Packaging Engineering (Packaging) roles from 46 employers tracked in the SemiconductorJobs index, counted 8 Nov 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.