$91,200 - $177,200 USD yearly
About the role
Manage and execute IC packaging process development while collaborating with internal design, manufacturing, and reliability teams as well as external material and equipment suppliers.
What you'll do
- Create project plans including timelines, costs, risk assessments, and mitigation plans.
- Execute NTI release to production through characterization, DOE, reliability testing, qualification, and high-volume validation.
- Drive projects focused on process development, design rule improvement, material development, cost reduction opportunities, and RMA or quality issue resolution.
- Utilize program management skills to keep multiple project activities within scope and schedule.
- Support domestic and international travel as needed.
What you'll need
- Bachelor's degree in Material Science, Mechanical Engineering, Chemical Engineering, Electrical Engineering, or a related specialization.
- Minimum of 5 years of relevant technical experience in semiconductor packaging technology.
- Technical expertise in failure analysis, material interaction, and yield improvement.
- Understanding of SPC, FMEAs, Six Sigma, and Reliability Standards.
Nice to have
- R&D experience in advanced SiP packaging development.
- Hands-on experience defining packaging design rules as well as process and material development across SMT, Flip Chip, Mold, and Singulation.
- Knowledge of Flip Chip Bumping, WLCSP, Fan Out, Stack integration, and Dual Side BGA/MGA.
- Experience with Cadence Allegro and AutoCAD design tools.
More semiconductor jobs: Packaging engineer jobs · Irvine jobs
This role has been open 138 days — well above the 59-day median for Packaging Engineering roles.
Packaging Engineering · Advanced Packaging
|
Open roles in category
321
|
Median days open
59 d
|
Category median salary (all employers)
$167k
|
See the full market breakdown ▾Category comparison, and who else is hiring
| Metric | Skyworks | All employers we track in this specialty (321 roles · 65 employers) |
|---|---|---|
| Open roles in this specialty | 8 | 321 |
| Open roles in the wider Process, Fab & Equipment family | 153 | 10057 · 117 employers |
| Median days open | 59 d | 59 d (same as this employer) |
| Median salary (USD postings) | — | $167k |
Who's hiring in this category
- Micron Technology · 42 open roles · median 54 d
- KLA Corporation · 40 open roles · median 150 d
- Intel Corporation · 23 open roles · median 30 d
- Renesas Electronics · 22 open roles · median 25 d
- Lumilens · 13 open roles · median 93 d
- Infineon Technologies · 11 open roles · median 49 d
How we counted: 321 open Packaging Engineering (Advanced Packaging) roles from 65 employers tracked in the SemiconductorJobs index, counted 8 Nov 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.